Monday, September 16
Device Testing Invited Talk - CDM Bare Die Testing, ESDA CDM Joint Working Group Technical Report Overview
Kathleen Muhonen
Kathleen Muhonen is currently an ESD engineer at Qorvo in Greensboro, NC. She is involved in ESD on-chip protection for RF and Millimeter wave applications. She is heavily involved in system level testing that helps standardize IED testing of RF components and instrumentation for better ESD characterization of clamps and materials. Previously she was responsible for RF characterization and model support for SOI switches and Gallium Arsenide power amplifiers. She has also done extensive work on developing state of the art harmonic and breakdown characterization system for semiconductors and has improved de-embedding techniques of large-scale modeling structures. Kathleen's previous experience includes assistant professor at Penn State Erie, linearization design for base stations at Hewlett Packard, and power amplifier design at Lockheed Martin and GE Aerospace.
Kathleen is a member of the ESD association and is on all device testing standards committees, including serving as past TLP and HMM workgroup chairs. She has also served on the Board of Directors and is now serving as the education committee chair. Kathleen received her BSEE degree from Michigan Technological University in 91, a MSEE from Syracuse in 94 and a PH.D.EE from Penn State University in 99.
Device Testing Invited Talk - CDM Bare Die Testing, ESDA CDM Joint Working Group Technical Report Overview
1B.1 TLP/VFTLP Investigation on eNVM 1T1R PCM in FD-SOI UTBB CMOS Technology at Room Temperature (ESREF Invited Paper)
Philippe Galy
Dr. Philippe Galy, born 1965, obtained his Ph.D. from the University of Bordeaux (France) in 1994. He holds also a H.D.R. (academic research supervisor) from LAAS CNRS University of Toulouse in 2005. He has authored or co-authored over 150 publications, 4 books, and 140 patents portfolio. Philippe serves in several technical program committee and he is a reviewer for many symposiums and journals (Ex: Nature/VLSI/TED/TON/SSE/ ESREF/ESSDERC/ICICDT/EUROSOI/CAS).
He joined STMicroelectronics in 2005, working on ESD/LU and new solutions from device to SOC level in advanced CMOS and mature technologies (Bulk / FD-SOI / planar & 3D). He develops tooling concepts for robust IP integration and supervises its developments till massive production. Moreover, its main R&D topics are on SCR, T2, TFET, BIMOS transistor, Beta-structure and other innovative devices for emerging neuromorphic, Qubit applications. Philippe is in charge for STMicroelectronics on Cryogenic Quantum R&D with many international partners. Based on these topics he supervises 16 PhD. He was already involved in National & European projects ( Ex.: Nano 2017/ROBIN/REMINDER/Neuram3/ QLSI/ARCTIC). Also, he joins the QuEng CDP group from Grenoble France. Its Position today is Fellow technical Director and adjunct professor at UdS.
1B.1 TLP/VFTLP Investigation on eNVM 1T1R PCM in FD-SOI UTBB CMOS Technology at Room Temperature (ESREF Invited Paper)
1B.2 Can CC-TLP be used as an Early Failure Analysis Tool?
Chloe Troussier
Chloé Troussier received her Ph.D. degree in 2022 from University Grenoble Alpes of Grenoble, France. During her Ph.D. thesis (20018-2022), she worked on on the study of Charged Device Model phenomenon in STMicroelectronics. Since 2021, she joined STMicroelectronics Crolles as a Research Engineer working on ESD protections and strategies.
1B.2 Can CC-TLP be used as an Early Failure Analysis Tool?
Authors Corner for 1B.1 and 1B.2
Philippe Galy
Dr. Philippe Galy, born 1965, obtained his Ph.D. from the University of Bordeaux (France) in 1994. He holds also a H.D.R. (academic research supervisor) from LAAS CNRS University of Toulouse in 2005. He has authored or co-authored over 150 publications, 4 books, and 140 patents portfolio. Philippe serves in several technical program committee and he is a reviewer for many symposiums and journals (Ex: Nature/VLSI/TED/TON/SSE/ ESREF/ESSDERC/ICICDT/EUROSOI/CAS).
He joined STMicroelectronics in 2005, working on ESD/LU and new solutions from device to SOC level in advanced CMOS and mature technologies (Bulk / FD-SOI / planar & 3D). He develops tooling concepts for robust IP integration and supervises its developments till massive production. Moreover, its main R&D topics are on SCR, T2, TFET, BIMOS transistor, Beta-structure and other innovative devices for emerging neuromorphic, Qubit applications. Philippe is in charge for STMicroelectronics on Cryogenic Quantum R&D with many international partners. Based on these topics he supervises 16 PhD. He was already involved in National & European projects ( Ex.: Nano 2017/ROBIN/REMINDER/Neuram3/ QLSI/ARCTIC). Also, he joins the QuEng CDP group from Grenoble France. Its Position today is Fellow technical Director and adjunct professor at UdS.
Chloe Troussier
Chloé Troussier received her Ph.D. degree in 2022 from University Grenoble Alpes of Grenoble, France. During her Ph.D. thesis (20018-2022), she worked on on the study of Charged Device Model phenomenon in STMicroelectronics. Since 2021, she joined STMicroelectronics Crolles as a Research Engineer working on ESD protections and strategies.
Authors Corner for 1B.1 and 1B.2
Manufacturing Invited Talk: Air Ionization and it’s Use in Controlling Static Charge
Carl Newberg
Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.
Manufacturing Invited Talk: Air Ionization and it’s Use in Controlling Static Charge
Manufacturing Invited Talk - Healthcare TBA
Manufacturing Invited Talk - Healthcare TBA
Manufacturing Invited Talk - Electrostatic Discharge (ESD) Control in Healthcare
Thomas Ricciardelli
Tom Ricciardelli received a SB and SM in Chemical Engineering from MIT in 1985 and an MBA from the Sloan School of Management in 1991. In 1993, he founded SelecTech with the mission of creating valuable products from recycled materials. He has over 30 years of experience with developing unique polymer blends to meet demanding technical requirements and holds several patents for products and processes using recycled materials. He was the first to conceive of and develop an adhesive-free, interlocking static-control flooring system which paved the way for the StaticStop line of industry-leading ESD flooring products.
With this product, he was flung headlong into the ESD industry and joined the ESD Association in 2013 to become more involved in the industry and better understand the full needs of his customers. He is now the chair of WG 7 and WG29 and a member of WG19, WG28, WG4, and WG97. “While I have a strong engineering background with degrees in chemical engineering, my knowledge of electronics and ESD was certainly limited. Being involved in the ESD association, through the committees, the available training information, and generous support from other members, I’ve learned a vast amount about ESD and its control. I particularly enjoy networking with the other members, working with them on the committees, and having a little fun during the free time.”
Manufacturing Invited Talk - Electrostatic Discharge (ESD) Control in Healthcare
M1.1 In-Situ ESD Current Sensing in a Pick and Place Machine
Ellen Jirutková
Ellen Jirutková joined the Analysis & Test group at Fraunhofer EMFT in 2018 and has been supporting the team in researching topics related to electrostatic discharges. She received her Bachelor (2018) and Master degree (2021) at the Technical University of Munich (TUM), Germany. Since then, she has been working as research associate at Fraunhofer EMFT, specializing on ESD test methods, ESD robustness and protection and simulations. In 2022, she started to work on her PhD with the focus on ESD risks in Multi-Chip Modules (MCM) and Systems in Package (SiP). Ellen is an active member of the ESD Association and joined the steering committee of the International ESD Workshop 2023 in Tutzing, Germany.
M1.1 In-Situ ESD Current Sensing in a Pick and Place Machine
M1.2 Qualification Challenges of Conductive and Dissipative Plastics
Toni Viheriäkoski
Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in healthcare, medical, electronics, automotive and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received specialist qualification in business management in 2018 and 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.
M1.2 Qualification Challenges of Conductive and Dissipative Plastics
Authors Corner for M1.1 and M1.2
Ellen Jirutková
Ellen Jirutková joined the Analysis & Test group at Fraunhofer EMFT in 2018 and has been supporting the team in researching topics related to electrostatic discharges. She received her Bachelor (2018) and Master degree (2021) at the Technical University of Munich (TUM), Germany. Since then, she has been working as research associate at Fraunhofer EMFT, specializing on ESD test methods, ESD robustness and protection and simulations. In 2022, she started to work on her PhD with the focus on ESD risks in Multi-Chip Modules (MCM) and Systems in Package (SiP). Ellen is an active member of the ESD Association and joined the steering committee of the International ESD Workshop 2023 in Tutzing, Germany.
Toni Viheriäkoski
Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in healthcare, medical, electronics, automotive and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received specialist qualification in business management in 2018 and 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.
Authors Corner for M1.1 and M1.2
Manufacturing Hands-On Intro Presentation - Ionization
Carl Newberg
Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.
Manufacturing Hands-On Intro Presentation - Ionization
Manufacturing Hands-On Session - Ionization
Carl Newberg
Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.
Manufacturing Hands-On Session - Ionization
Tuesday, September 17
Manufacturing Hands-On Intro Presentation - Personnel Grounding
Manufacturing Hands-On Intro Presentation - Personnel Grounding
Manufacturing Hands-on Session - Personnel Grounding
Manufacturing Hands-on Session - Personnel Grounding
Manufacturing Invited Talk - Overview of all ESDA Control Standards
Wolfgang Stadler
Wolfgang Stadler received his diploma degree in physics in 1991 and in 1995 the PhD degree from the Physics Department of the Technical University Munich. 1995 he joined the semiconductor division of Siemens, which became Infineon Technologies in 1999. His focus was on development of ESD-protection concepts in CMOS technologies and on innovative ESD topics. In this role he was coordinator of several European and German ESD funding projects. Since 2003 he was also responsible for the measurement characterization of I/O cells and PHYs. 2011 he joined Intel Mobile Communications which is now Intel Germany Services GmbH. Within the Corporate Quality Network, he is currently responsible for the ESD Control Program of Intel and for ESD risk assessment. Furthermore, he supports ESD/latch-up testing and qualification of products. Wolfgang holds several patents in ESD-related topics. He is author or co-author of more than 120 technical papers and has co-authored a book on ESD simulation. He received several Best Paper Awards and gives regularly courses on ESD device testing, ESD qualification, and ESD control measures (for example, TR53 ESD Technician Certification). He is an active member of the EOS/ESD Association working groups related to device and system testing, ESD control, and ESD process assessment. He is also a member of STDCOM and TAS of the EOS/ESD Association. Currently he is the committee chair of the EOS/ESD Association Working Group 5.4 “Transient Latch-up” (since 2011) and the Working Group 12 “Seating”; since 2013 he has been co-chairing the ESDA Working Group 17 “Process Assessment”. Wolfgang has been elected to serve on the Board of Directors of the EOS/ESD Association for 2014–2019; 2015–2022 he was Education Business Unit Manager of the ESDA. Since 2015 he is acting as the president of the German ESD FORUM e.V. In 2019, he received the Outstanding Contribution Award of the EOS/ESD Association.
Manufacturing Invited Talk - Overview of all ESDA Control Standards
Device Testing Workshop - Contact CDM: From Characterization Tool to Qualification Standard
Peter de Jong
Tom Meuse
Tom Meuse is an Applications/Product/Technology Engineer for the Compliance Test Solutions division of Thermo Fisher Scientific, which is in Tewksbury MA, USA. He is responsible for the Thermo Scientific ESD and Latch-up test system operations and future product research. Tom is a member of the ESD Association Device Testing (WG-5.x) committee, chair of the ESDA's WG14 System Level working group and a member of the JEDEC JC-14.1 Committee on Reliability Test Methods. He's also a member of the Joint ESDA/JEDEC Device Testing work group and a contributing member to the Industry Council on ESD Target Levels. In addition, he's also a Board of Directors member on both the National and the Northeast Chapter of the ESD Association. During Tom's 40 plus year career, which began with KeyTek Instruments, he worked on Surge and ESD simulator designs, in both an engineering capacity and as the project manager on both system level and device level testers. He's provided numerous technical seminars focusing on ESD/Latch-up testing and Standards Evolution and has authored and co-authored numerous papers on topics relating to ESD device level testing and ESD system design.
Device Testing Workshop - Contact CDM: From Characterization Tool to Qualification Standard
2B.1 Consideration of Waveform Analysis and Test Method for Charged Board Event (RCJ Exchange Paper)
Masanori Sawada
Masanori Sawada was born in Wakayama, Japan, 1973. He received his M.S. from Wakayama University in March 1998. He joined Hanwa Electronic Ind. in April 1998. Currently, he is the president of HANWA ELECTRONIC IND.
2B.1 Consideration of Waveform Analysis and Test Method for Charged Board Event (RCJ Exchange Paper)
2B.2 Proposing a Strategy to Prevent Module-level Charged Device Model Failures in Dual In-line Memory Modules
Youngbong Han
Youngbong Han received his B.S. degree in 2015 and his M.S. and Ph.D degrees in 2020 from the College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea. Since 2020, he has been working on quality assurance tasks related to Electromagnetic Compatibility, Electrostatic Discharge, and Signal Integrity at Samsung Electronics' Device Solutions Quality Synergy P/J.
2B.2 Proposing a Strategy to Prevent Module-level Charged Device Model Failures in Dual In-line Memory Modules
Authors Corner for 2B.1 and 2B.2
Youngbong Han
Youngbong Han received his B.S. degree in 2015 and his M.S. and Ph.D degrees in 2020 from the College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea. Since 2020, he has been working on quality assurance tasks related to Electromagnetic Compatibility, Electrostatic Discharge, and Signal Integrity at Samsung Electronics' Device Solutions Quality Synergy P/J.
Masanori Sawada
Masanori Sawada was born in Wakayama, Japan, 1973. He received his M.S. from Wakayama University in March 1998. He joined Hanwa Electronic Ind. in April 1998. Currently, he is the president of HANWA ELECTRONIC IND.
Authors Corner for 2B.1 and 2B.2
2B.3 Intrinsic Inductance and Time-Dependent Resistance of the FI-CDM Spark
Timothy J. Maloney
Timothy J. Maloney graduated in physics and EE from MIT (SB 1971) and Cornell (MS 1973, PhD 1976). Following postdoctoral work at Cornell and semiconductor research at Varian Associates, Palo Alto, CA, he joined Intel Corp., Santa Clara, CA, in 1984, and has been concerned with IC ESD protection and testing, signal integrity, system ESD, and other topics. Dr. Maloney became a Senior Principal Engineer at Intel and retired in 2016. He has 40 patents, is co-author of a book, "Basic ESD and I/O Design" (Wiley, 1998), and is a Fellow of the IEEE. He has many publications at the EOS/ESD Symposium, IRPS, and other IEEE-connected entities.
2B.3 Intrinsic Inductance and Time-Dependent Resistance of the FI-CDM Spark
2B.4 The Demand for a CDM Bare Die Testing Method
Lena Zeitlhoefler
Lena Zeitlhöfler received her Master's degree in Electrical Engineering in 2017 from the Technical University of Munich (TUM). During her time as a Ph.D. student at the TUM, she worked in cooperation with Infineon Technologies AG in the fields of ESD and, particularly, on the physics of CDM and CDM simulation. She joined the ESD Team of Infineon in Munich, Germany, full-time in September 2021.
2B.4 The Demand for a CDM Bare Die Testing Method
2B.5 FI-CDM and LICCDM Testing on Wafer, Single Die, and Package Levels
Marko Simicic
Marko Simicic received the M.Sc. degree in electrical engineering and information technology from the University of Zagreb, Croatia, in 2012. He obtained a PhD degree from the department of electrical engineering ESAT, KU Leuven, Belgium in 2018. Since 2017 he is an ESD researcher in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 40 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing and ESD control process assessment.
2B.5 FI-CDM and LICCDM Testing on Wafer, Single Die, and Package Levels
Authors Corner for 2B.3, 2B.4, and 2B.5
Timothy J. Maloney
Timothy J. Maloney graduated in physics and EE from MIT (SB 1971) and Cornell (MS 1973, PhD 1976). Following postdoctoral work at Cornell and semiconductor research at Varian Associates, Palo Alto, CA, he joined Intel Corp., Santa Clara, CA, in 1984, and has been concerned with IC ESD protection and testing, signal integrity, system ESD, and other topics. Dr. Maloney became a Senior Principal Engineer at Intel and retired in 2016. He has 40 patents, is co-author of a book, "Basic ESD and I/O Design" (Wiley, 1998), and is a Fellow of the IEEE. He has many publications at the EOS/ESD Symposium, IRPS, and other IEEE-connected entities.
Marko Simicic
Marko Simicic received the M.Sc. degree in electrical engineering and information technology from the University of Zagreb, Croatia, in 2012. He obtained a PhD degree from the department of electrical engineering ESAT, KU Leuven, Belgium in 2018. Since 2017 he is an ESD researcher in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 40 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing and ESD control process assessment.
Lena Zeitlhoefler
Lena Zeitlhöfler received her Master's degree in Electrical Engineering in 2017 from the Technical University of Munich (TUM). During her time as a Ph.D. student at the TUM, she worked in cooperation with Infineon Technologies AG in the fields of ESD and, particularly, on the physics of CDM and CDM simulation. She joined the ESD Team of Infineon in Munich, Germany, full-time in September 2021.
Authors Corner for 2B.3, 2B.4, and 2B.5
Wednesday, September 18
3B.1 A Statistical Explanation of CDM Qualification Variability
Theo Smedes
After receiving his Ph.D. from the Eindhoven University of Technology with a thesis on compact device modelling, Theo Smedes worked at the Delft University of Technology on layout-to-circuit extraction. In 1995 he joined NXP Semiconductors (Philips Semiconductors at that time), working on tools for statistical design. Currently, he is NXP Fellow for ESD and Latch-up. Theo is member of all ESDA device testing working groups and chairs the TLP working group. He published several papers on ESD and received the 2007 Best Paper Award and the 2009, 2018 and 2022 Outstanding Paper Award of the EOS/ESD Symposium. Theo was general chair of the EOS/ESD Symposium in 2013. He has been recognized with ESDA's David F. Barber Sr. Memorial Award (2017) and Outstanding Contribution Award (2022).
3B.1 A Statistical Explanation of CDM Qualification Variability
3B.2 Secondary Discharges during FICDM stress - Source and Solution
Sheela Verwoerd
Sheela Verwoerd received her M.Sc in Applied Physics in 2000 at the Indian Institute of Technology, Madras, India. She then moved to the Netherlands, where she did her PhD on "Full Chip Modelling of ICs under CDM stress" in the University of Twente in Enschede. She worked as ESD Assurance Engineer at Philips Semiconductors for a couple of years. After a brief gap of 10 years, she joined NXP Semiconductors as Principal ESD/LU test Engineer. She had been focused on ESD/LU qualification of ICs since then.
3B.2 Secondary Discharges during FICDM stress - Source and Solution
3B.3 System CDM Modeling for High-Speed Interface Devices
Emanuele Groppo
Emanuele Groppo received his B.Sc. (2020) and M.Sc. (2022) in Electronic Engineering from Politecnico di Torino, Italy. He is currently pursuing a Ph.D. at the Technical University of Munich (TUM), Chair of Circuit Design. In 2023, he joined the ESD team at Intel in Munich, Germany. The focus of his research is on novel ESD devices and solutions for advanced semiconductor technologies.
3B.3 System CDM Modeling for High-Speed Interface Devices
Authors Corner for 3B.1, 3B.2, and 3B.3
Emanuele Groppo
Emanuele Groppo received his B.Sc. (2020) and M.Sc. (2022) in Electronic Engineering from Politecnico di Torino, Italy. He is currently pursuing a Ph.D. at the Technical University of Munich (TUM), Chair of Circuit Design. In 2023, he joined the ESD team at Intel in Munich, Germany. The focus of his research is on novel ESD devices and solutions for advanced semiconductor technologies.
Theo Smedes
After receiving his Ph.D. from the Eindhoven University of Technology with a thesis on compact device modelling, Theo Smedes worked at the Delft University of Technology on layout-to-circuit extraction. In 1995 he joined NXP Semiconductors (Philips Semiconductors at that time), working on tools for statistical design. Currently, he is NXP Fellow for ESD and Latch-up. Theo is member of all ESDA device testing working groups and chairs the TLP working group. He published several papers on ESD and received the 2007 Best Paper Award and the 2009, 2018 and 2022 Outstanding Paper Award of the EOS/ESD Symposium. Theo was general chair of the EOS/ESD Symposium in 2013. He has been recognized with ESDA's David F. Barber Sr. Memorial Award (2017) and Outstanding Contribution Award (2022).
Sheela Verwoerd
Sheela Verwoerd received her M.Sc in Applied Physics in 2000 at the Indian Institute of Technology, Madras, India. She then moved to the Netherlands, where she did her PhD on "Full Chip Modelling of ICs under CDM stress" in the University of Twente in Enschede. She worked as ESD Assurance Engineer at Philips Semiconductors for a couple of years. After a brief gap of 10 years, she joined NXP Semiconductors as Principal ESD/LU test Engineer. She had been focused on ESD/LU qualification of ICs since then.
Authors Corner for 3B.1, 3B.2, and 3B.3
Device Testing Invited Talk TBA
Device Testing Invited Talk TBA
Manufacturing Workshop - Factory Controls Ionization
Manufacturing Workshop - Factory Controls Ionization
Manufacturing Invited Paper - Static Control for Roll to Roll Manufacturing
Kelly Robinson
Kelly has over 35 years of industrial experience solving manufacturing problems and commercializing new products. Dr. Robinson holds the PhD in electrical engineering (Colorado State University), is a Professional Engineer (New York), and is a Patent Agent. Previously, he worked at the Eastman Kodak Company for 25 years developing and commercializing copier technologies, imaging products, and controlling static in roll-to-roll manufacturing of photographic papers and films where the light from static sparks caused customer observable product defects. In 2007, he founded Electrostatic Answers, an engineering consulting company dedicated to eliminating injury and waste from static electricity, which has served over 100 clients including many Fortune 500 companies. Kelly is an IEEE Fellow (2011) cited for contributions to the static performance of manufacturing operations, chairs the National Fire Protection Assoc. (NFPA) Static Electricity Committee (2018), is an associate editor of the Journal of Electrostatics (2015), a contributing editor on static control (2009) for Paper, Film & Foil Converter (PFFC), serves on the Technical Advisory Panel (2019) of the Association of International Metallizers, Coaters, and Laminators (AIMCAL), and is the inventor on 15 issued US patents. He has authored over 90 trade articles and peer reviewed publications on applied electrostatics.
Manufacturing Invited Paper - Static Control for Roll to Roll Manufacturing
M2.1 Static Cracking Due to Electro-Static Discharge During Glass Substrate Transferring System in Vacuum
DongSun Kim
DongSun Kim received a PhD in Materials Science from Korea University. His research interests are how to improve products yield include circuit design, process integration, and adoption of materials in contact with products based on dissipative polymers directed towards prevention ESD in display and semiconductor industry. He has worked in LG Semiconductor since 1992 and currently working as an engineering fellow in LG Display.
M2.1 Static Cracking Due to Electro-Static Discharge During Glass Substrate Transferring System in Vacuum
M2.2 Using Discharge Current Measurements in Risk Assessments
Istvan Kovalik
Istvan Kovalik began his work in the field of ESD control in 2003. He's been working as an ESD Coordinator at Harman for 9 years, and responsible for all aspects of ESD control in 3 facilities in his country. He performs some volunteer works for ESDA and received his ESD Program Manager Certification in 2023.
M2.2 Using Discharge Current Measurements in Risk Assessments
Authors Corner for M2.1 and M2.2
DongSun Kim
DongSun Kim received a PhD in Materials Science from Korea University. His research interests are how to improve products yield include circuit design, process integration, and adoption of materials in contact with products based on dissipative polymers directed towards prevention ESD in display and semiconductor industry. He has worked in LG Semiconductor since 1992 and currently working as an engineering fellow in LG Display.
Istvan Kovalik
Istvan Kovalik began his work in the field of ESD control in 2003. He's been working as an ESD Coordinator at Harman for 9 years, and responsible for all aspects of ESD control in 3 facilities in his country. He performs some volunteer works for ESDA and received his ESD Program Manager Certification in 2023.