Monday, September 16

9:30 AM

Device Testing Invited Talk - CDM Bare Die Testing, ESDA CDM Joint Working Group Technical Report Overview

10:50 AM

1B.1 TLP/VFTLP Investigation on eNVM 1T1R PCM in FD-SOI UTBB CMOS Technology at Room Temperature (ESREF Invited Paper)

11:15 AM

1B.2 Can CC-TLP be used as an Early Failure Analysis Tool?

11:40 AM

Authors Corner for 1B.1 and 1B.2

1:00 PM

Manufacturing Invited Talk: Air Ionization and it’s Use in Controlling Static Charge

1:50 PM

Manufacturing Invited Talk - Healthcare TBA

2:15 PM

Manufacturing Invited Talk - Electrostatic Discharge (ESD) Control in Healthcare

3:10 PM

M1.1 In-Situ ESD Current Sensing in a Pick and Place Machine

3:35 PM

M1.2 Qualification Challenges of Conductive and Dissipative Plastics

4:00 PM

Authors Corner for M1.1 and M1.2

4:20 PM

Manufacturing Hands-On Intro Presentation - Ionization

4:45 PM

Manufacturing Hands-On Session - Ionization

Tuesday, September 17

9:45 AM

Manufacturing Hands-On Intro Presentation - Personnel Grounding

10:10 AM

Manufacturing Hands-on Session - Personnel Grounding

12:00 PM

Manufacturing Invited Talk - Overview of all ESDA Control Standards

3:35 PM

2B.1 Consideration of Waveform Analysis and Test Method for Charged Board Event (RCJ Exchange Paper)

4:00 PM

2B.2 Proposing a Strategy to Prevent Module-level Charged Device Model Failures in Dual In-line Memory Modules

4:25 PM

Authors Corner for 2B.1 and 2B.2

4:55 PM

2B.3 Intrinsic Inductance and Time-Dependent Resistance of the FI-CDM Spark

5:20 PM

2B.4 The Demand for a CDM Bare Die Testing Method

5:45 PM

2B.5 FI-CDM and LICCDM Testing on Wafer, Single Die, and Package Levels

6:10 PM

Authors Corner for 2B.3, 2B.4, and 2B.5

Wednesday, September 18

9:40 AM

3B.1 A Statistical Explanation of CDM Qualification Variability

10:05 AM

3B.2 Secondary Discharges during FICDM stress - Source and Solution

10:30 AM

3B.3 System CDM Modeling for High-Speed Interface Devices

10:55 AM

Authors Corner for 3B.1, 3B.2, and 3B.3

11:15 AM

Device Testing Invited Talk TBA

2:55 PM

Manufacturing Invited Paper - Static Control for Roll to Roll Manufacturing

3:45 PM

M2.1 Static Cracking Due to Electro-Static Discharge During Glass Substrate Transferring System in Vacuum

4:10 PM

M2.2 Using Discharge Current Measurements in Risk Assessments

4:35 PM

Authors Corner for M2.1 and M2.2

4:55 PM

Manufacturing Hands-On Intro Presentation - Process Assessment

5:20 PM

Manufacturing Hands-On Session - Process Assessment