Agenda

Yujie Zhou received the B.S. degree in electrical engineering from University of Illinois Urbana-Champaign (UIUC), Urbana, IL,USA, in 2019. He is currently pursuing the Ph.D. degree in electrical engineering with UIUC. His research interests include ESD, device physics, compact modeling, and TCAD.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering, and M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. degree from the Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, in 2015. He worked at Freescale / NXP Semiconductors, Austin, TX, from 2015 to 2021. He joined Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA for SoC integration and ESD/latch-up design verification.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering, and M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. degree from the Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, in 2015. He worked at Freescale / NXP Semiconductors, Austin, TX, from 2015 to 2021. He joined Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA for SoC integration and ESD/latch-up design verification.

Yujie Zhou received the B.S. degree in electrical engineering from University of Illinois Urbana-Champaign (UIUC), Urbana, IL,USA, in 2019. He is currently pursuing the Ph.D. degree in electrical engineering with UIUC. His research interests include ESD, device physics, compact modeling, and TCAD.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Dr. Chuan Xu received the B.S. and the M.S. from Peking University. He received the Ph.D. from University of California at Santa Barbara in 2012. During his Ph.D. program, he interned with IBM T. J. Watson Research Center and Mentor Graphics Corporation. In 2012, he joined the Device Modeling Team of Legacy Maxim Integrated (acquired by Analog Devices since 2021). His current research interests include modeling of active devices, parasitic devices, interconnects and packages in VLSI circuits. He has authored or co-authored over 40 journal and conference papers.

Subhadeep Ghosh received his Bachelor's Degree in Electronics from Jadavpur University, Kolkata, India, and Masters Degree in Electronics from Indian Institute of Technology, Kharagpur, India. He joined Texas Instruments in Bangalore, India in 2005 and has since worked on Reliability EDA development for EMIR analysis, Transistor reliability and ESD. Currently he leads the EDA Development for Reliability, ESD and IR-drop analyses for all TI internal process nodes. He is a Member, Group Technical Staff (MGTS). His areas of expertise are design reliability, ESD EDA, digital design IR-drop, with methods enabling reliability as a specification through the design flow.

Subhadeep Ghosh received his Bachelor's Degree in Electronics from Jadavpur University, Kolkata, India, and Masters Degree in Electronics from Indian Institute of Technology, Kharagpur, India. He joined Texas Instruments in Bangalore, India in 2005 and has since worked on Reliability EDA development for EMIR analysis, Transistor reliability and ESD. Currently he leads the EDA Development for Reliability, ESD and IR-drop analyses for all TI internal process nodes. He is a Member, Group Technical Staff (MGTS). His areas of expertise are design reliability, ESD EDA, digital design IR-drop, with methods enabling reliability as a specification through the design flow.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Dr. Chuan Xu received the B.S. and the M.S. from Peking University. He received the Ph.D. from University of California at Santa Barbara in 2012. During his Ph.D. program, he interned with IBM T. J. Watson Research Center and Mentor Graphics Corporation. In 2012, he joined the Device Modeling Team of Legacy Maxim Integrated (acquired by Analog Devices since 2021). His current research interests include modeling of active devices, parasitic devices, interconnects and packages in VLSI circuits. He has authored or co-authored over 40 journal and conference papers.

Daniel Cooley serves as Chief Technology Officer and Senior Vice President, Technology and Product Development, where he is responsible for the company’s overall research and development strategy and execution. Cooley is a respected IoT industry veteran and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Previously, Daniel served as Senior Vice President and Chief Strategy Officer, where he led Silicon Labs’ overall strategy, corporate development, M&A, emerging markets, and security. Prior to that, Daniel led Silicon Labs’ IoT business as Senior Vice President and General Manager. Since 2005, Cooley has served in a variety of engineering and business leadership positions at Silicon Labs in the US, Asia and Europe. He has an M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering from The University of Texas at Austin and holds five patents in radio and low-power technology. Daniel currently serves on the board of directors for the Cockrell School of Engineering Advisory Board and the Austin Symphony Orchestra.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Steffen Holland received his diploma and PhD in Physics from the University of Hamburg in 2004. He joined Philips Semiconductors/NXP/Nexperia in the process development group for discrete bipolar devices in Hamburg, Germany in 2005. The main focus of his work quickly became TCAD process and device simulations for discrete ESD protection devices. He works now on discrete ESD protection devices. His current interests are system level ESD simulations. He currently serves in the Board of Directors at the ESD Association and is chair of the ESDA working group 26.

Steffen Holland received his diploma and PhD in Physics from the University of Hamburg in 2004. He joined Philips Semiconductors/NXP/Nexperia in the process development group for discrete bipolar devices in Hamburg, Germany in 2005. The main focus of his work quickly became TCAD process and device simulations for discrete ESD protection devices. He works now on discrete ESD protection devices. His current interests are system level ESD simulations. He currently serves in the Board of Directors at the ESD Association and is chair of the ESDA working group 26.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Shih-Hung Chen has been with imec since 2010, and as ESD team lead and principal member of technical staff (PMTS) since 2019. He authored or co-authored more than 100 conference and journal publications. His current research interests include ESD protections in advanced sub-5nm technology nodes, in 3D/2.5D IC applications, and in Design Technology Co-Optimization (DTCO), System Technology Co-Optimization (STCO) with the integrations of III-V compounds.

Dr. Vladislav Vashchenko is currently Sr. Director Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latchup IC co-design business process and technology development. Previously he managed ESD technology development at National Semiconductor (2000-2011). He received MS Engineer-Physicist (1987), Ph.D. in Physics of Semiconductors from MIPT (1990), "Doctor of Science in Microelectronics" habilitation degree (1997). He is author of 150 U.S. patents, over 120 papers, co-author of the three books in ESD field.

Michael Amato graduated from Rensselaer Polytechnic Institute with a BSEE in ‘82 and MSEE in '84, with emphasis in semiconductor device and IC technology. At Philips Research he led teams developing new monolithic Power IC technologies and TFT arrays for LCD HDTV. Working at Allegro Microsystems & CPClare (IXYS), he also directed CAD/PDK development and device modeling. In 2004 he joined Linear Technology Corp (now Analog Devices Inc) directing all ESD Co-design and new ESD device development for in-house and foundry processes, developing unique ESD solutions for High Voltage, Power, Analog, Digital, and Mixed Signal ICs.

Michael Amato graduated from Rensselaer Polytechnic Institute with a BSEE in ‘82 and MSEE in '84, with emphasis in semiconductor device and IC technology. At Philips Research he led teams developing new monolithic Power IC technologies and TFT arrays for LCD HDTV. Working at Allegro Microsystems & CPClare (IXYS), he also directed CAD/PDK development and device modeling. In 2004 he joined Linear Technology Corp (now Analog Devices Inc) directing all ESD Co-design and new ESD device development for in-house and foundry processes, developing unique ESD solutions for High Voltage, Power, Analog, Digital, and Mixed Signal ICs.

Shih-Hung Chen has been with imec since 2010, and as ESD team lead and principal member of technical staff (PMTS) since 2019. He authored or co-authored more than 100 conference and journal publications. His current research interests include ESD protections in advanced sub-5nm technology nodes, in 3D/2.5D IC applications, and in Design Technology Co-Optimization (DTCO), System Technology Co-Optimization (STCO) with the integrations of III-V compounds.

Dr. Vladislav Vashchenko is currently Sr. Director Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latchup IC co-design business process and technology development. Previously he managed ESD technology development at National Semiconductor (2000-2011). He received MS Engineer-Physicist (1987), Ph.D. in Physics of Semiconductors from MIPT (1990), "Doctor of Science in Microelectronics" habilitation degree (1997). He is author of 150 U.S. patents, over 120 papers, co-author of the three books in ESD field.

Frank Altmann received his Diploma in Physics from the Technical University, Dresden. He joined the Fraunhofer IWM (now IMWS) in 1997 and has since been concerned with material diagnostics and failure analysis of semiconductor components. Since 2006, he has been head of the research group Diagnostics of Semiconductor Technologies, with responsibility for national and international research projects with industry and public organizations focusing on 3D packaging and Si and GaN chip technologies. Since 2019, he has been acting head of the department of Electronic Materials and Components. Frank Altmann has authored and co-authored more than 130 publications, is active within several national and international failure analysis conferences and education committees, and was the general chair of ISTFA 2023.

Wei-Min Wu received the dual-Ph.D. degrees in electrical engineering from the KU Leuven, Belgium, and in electronic engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan in 2022. He is now with IMEC, Leuven, Belgium as an RF ESD researcher. His current research interests include ESD protections in Design Technology Co-Optimization (DTCO) with the Si/III-V RF devices and circuits and in high-speed I/O technology.

James Davis received a B.S. degree in electrical engineering from Brigham Young University (Provo, Utah USA) in 2002. He has been involved with on-chip ESD protection at Micron Technology, Inc. (Boise, Idaho USA) for the past twenty years. He is currently part of the R&D group focusing on on-chip ESD protection and design for NAND flash products. Mr. Davis is currently a Senior Member Technical Staff ESD/Latchup engineer.

Priya Walimbe has a master's degree in EE wand 25 years of experience in High Speed IO and Analog design. Currently, she is a Principal Engineer at Intel, providing technical leadership for innovations in state-of-the-art IO design and methodologies. She one of the leaders in architecture and design of several generations of DDR/LPDDR PHYs. She has heavily contributed to design technology co-optimization on Intel internal and external foundry. Priya has been an active member of ESD community at Intel, leading ESD design and verification improvements and innovations. She holds 6 patents, authored/co-authored many publications. She's art loving and enjoys classical music.

James Davis received a B.S. degree in electrical engineering from Brigham Young University (Provo, Utah USA) in 2002. He has been involved with on-chip ESD protection at Micron Technology, Inc. (Boise, Idaho USA) for the past twenty years. He is currently part of the R&D group focusing on on-chip ESD protection and design for NAND flash products. Mr. Davis is currently a Senior Member Technical Staff ESD/Latchup engineer.

Priya Walimbe has a master's degree in EE wand 25 years of experience in High Speed IO and Analog design. Currently, she is a Principal Engineer at Intel, providing technical leadership for innovations in state-of-the-art IO design and methodologies. She one of the leaders in architecture and design of several generations of DDR/LPDDR PHYs. She has heavily contributed to design technology co-optimization on Intel internal and external foundry. Priya has been an active member of ESD community at Intel, leading ESD design and verification improvements and innovations. She holds 6 patents, authored/co-authored many publications. She's art loving and enjoys classical music.

Wei-Min Wu received the dual-Ph.D. degrees in electrical engineering from the KU Leuven, Belgium, and in electronic engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan in 2022. He is now with IMEC, Leuven, Belgium as an RF ESD researcher. His current research interests include ESD protections in Design Technology Co-Optimization (DTCO) with the Si/III-V RF devices and circuits and in high-speed I/O technology.

Al Griffin joined Texas Instruments, Inc. in 1996, and was elected Senior Fellow in February 2020. He has over 30 years of experience in metallurgy, materials science, materials reliability and materials integration, particularly with respect to semiconductor and printed circuit board manufacturing. Al Griffin manages some of TI’s most critical customer return, excursion and qualification issues across all of TI’s technologies and factories and is a founding member of The Red Team, a problem-solving organization. He has worked with most of TI’s top engineers, designers and customers and has collaborated across TI to solve customers’ problems and a wide range of worldwide TI wafer fab and AT issues. Al received his B.S. in Metallurgical Engineering from the University of Texas at El Paso and his Ph.D. and M.S. in Materials Science from Rice University. 

Marko Simicic received the M.Sc. degree in electrical engineering and information technology from the University of Zagreb, Croatia, in 2012. He obtained a PhD degree from the department of electrical engineering ESAT, KU Leuven, Belgium in 2018. Since 2017 he is an ESD researcher in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 40 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing and ESD control process assessment.

Dr. Christian Russ received his MS and PhD degrees in electrical engineering from the Technical University of Munich, Germany, in 1991 and 1999, respectively. He has spent more than 30 years in the field of ESD: from 1994 through 1998, he was with IMEC, Leuven, Belgium, and from 1998 through 2003 he worked for Sarnoff Corporation, Princeton, New Jersey, USA. In 2003, he joined Infineon Technologies, Munich, Germany. In 2011, he transferred to Intel Mobile Communications where he developed ESD concepts for planar and FinFET CMOS technologies. Since 2017, he has been at Infineon Technologies as lead principal engineer for ESD solutions in automotive sensor technologies (Smart Power, CMOS, BiCMOS). Christian was recipient of several Best Paper Awards at the EOS/ESD Symposia (1993, 1996, 1998, 2000, 2001, 2005, 2012 and 2021) and at the ESREF Conference (1993, 1995). He has published over 75 conference and journal publications and has been awarded over 80 patents in his field.

Hsin-Yu Chen received the B.S. degree from the Department of Applied Physics, National University of Kaohsiung, Kaohsiung, Taiwan, in 2016, and the M.S. degree from the Institute of Electrophysics, National Chiao-Tung University, Hsinchu, Taiwan, in 2019. She joined Taiwan Semiconductor Manufacturing Company (TSMC) in 2019 and she is in ESD/EOS Technology Department.

Tzu-Hao Chiang received the B.S. degree in electrical engineering and the M.S. degree in electronic engineering from National Taiwan University, Taipei, Taiwan, in 2020. He joined Taiwan Semiconductor Manufacturing Company (TSMC) in 2020, where he is currently a Senior Engineer in ESD/EOS Technology Department. His work is mainly on single event latchup (SEL) and ESD victim design solution development.

Hsin-Yu Chen received the B.S. degree from the Department of Applied Physics, National University of Kaohsiung, Kaohsiung, Taiwan, in 2016, and the M.S. degree from the Institute of Electrophysics, National Chiao-Tung University, Hsinchu, Taiwan, in 2019. She joined Taiwan Semiconductor Manufacturing Company (TSMC) in 2019 and she is in ESD/EOS Technology Department.

Tzu-Hao Chiang received the B.S. degree in electrical engineering and the M.S. degree in electronic engineering from National Taiwan University, Taipei, Taiwan, in 2020. He joined Taiwan Semiconductor Manufacturing Company (TSMC) in 2020, where he is currently a Senior Engineer in ESD/EOS Technology Department. His work is mainly on single event latchup (SEL) and ESD victim design solution development.

Dr. Christian Russ received his MS and PhD degrees in electrical engineering from the Technical University of Munich, Germany, in 1991 and 1999, respectively. He has spent more than 30 years in the field of ESD: from 1994 through 1998, he was with IMEC, Leuven, Belgium, and from 1998 through 2003 he worked for Sarnoff Corporation, Princeton, New Jersey, USA. In 2003, he joined Infineon Technologies, Munich, Germany. In 2011, he transferred to Intel Mobile Communications where he developed ESD concepts for planar and FinFET CMOS technologies. Since 2017, he has been at Infineon Technologies as lead principal engineer for ESD solutions in automotive sensor technologies (Smart Power, CMOS, BiCMOS). Christian was recipient of several Best Paper Awards at the EOS/ESD Symposia (1993, 1996, 1998, 2000, 2001, 2005, 2012 and 2021) and at the ESREF Conference (1993, 1995). He has published over 75 conference and journal publications and has been awarded over 80 patents in his field.