Agenda

Chandra Mouli is with Micron Technology Inc., Boise, ID, USA. He is currently Vice President of Device Technology R&D with responsibilities in the areas of device characterization, reliability analysis, compact models, test structure design, process & device modeling for all technologies under development in R&D. He received his undergraduate degree in Physics and MSEE from the Indian Institute of Science (IISc), Bangalore, India and Ph.D. (EE) from the University of Texas at Austin in 1994. He has previously worked at Texas Instruments Inc. He was a visiting scholar (VSRP program) at the Tata Institute of Fundamental Research (TIFR) and has been an intern at the Defense Electronics Application Lab (DEAL) in Dehra Dun. His interests include semiconductor devices and process technology for advanced memory, optoelectronic devices, and exploratory research in the area of new materials and device structures. He has ~500 issued patents and several pending in various areas of semiconductor devices and processes – in advanced memory, novel exploratory devices, image sensors, high-speed interconnects, and related technologies. He has served on the technical committees for various conferences, including IEDM, IRPS, and SISPAD. He has also served on the review committees for NSF and SRC and as an editor for IEEE Electron Device Letters (EDL).

Daniel Cooley serves as Chief Technology Officer and Senior Vice President, Technology and Product Development, where he is responsible for the company’s overall research and development strategy and execution. Cooley is a respected IoT industry veteran and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Previously, Daniel served as Senior Vice President and Chief Strategy Officer, where he led Silicon Labs’ overall strategy, corporate development, M&A, emerging markets, and security. Prior to that, Daniel led Silicon Labs’ IoT business as Senior Vice President and General Manager. Since 2005, Cooley has served in a variety of engineering and business leadership positions at Silicon Labs in the US, Asia and Europe. He has an M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering from The University of Texas at Austin and holds five patents in radio and low-power technology. Daniel currently serves on the board of directors for the Cockrell School of Engineering Advisory Board and the Austin Symphony Orchestra.

Frank Altmann received his Diploma in Physics from the Technical University, Dresden. He joined the Fraunhofer IWM (now IMWS) in 1997 and has since been concerned with material diagnostics and failure analysis of semiconductor components. Since 2006, he has been head of the research group Diagnostics of Semiconductor Technologies, with responsibility for national and international research projects with industry and public organizations focusing on 3D packaging and Si and GaN chip technologies. Since 2019, he has been acting head of the department of Electronic Materials and Components. Frank Altmann has authored and co-authored more than 130 publications, is active within several national and international failure analysis conferences and education committees, and was the general chair of ISTFA 2023.