Agenda

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering and his M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. from the Department of Electrical and Computer Engineering at the University of Illinois Urbana-Champaign in 2015. He worked at NXP Semiconductors, Austin, TX, from 2015 to 2021. He has been with Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA development for SoC integration and ESD/latch-up design verification.

Weiying Li received her M.S. degree in Millimeter Wave and Solid State Electronics from the University of California, Davis, USA, in 2000. She began her career in Motorola's semiconductor division, which later became Freescale Semiconductor in 2004 and subsequently NXP Semiconductors in 2016. Her technical work focused on advanced ESD device modeling, failure mechanism analysis, and simulation to support product quality root-cause investigations. Her additional interests included EMC/ICIM behavioral modeling, substrate noise modeling, and predictive analysis for mixed-signal and RF SoC platforms. She is currently with NXP's Technology and Quality Solutions organization in Beijing, China, specializing in ESD compact modeling and SPICE level model development. She is also a member of the Si2 CMC ASM ESD diode model workgroup and the ESD FET model workgroup.

Weiying Li received her M.S. degree in Millimeter Wave and Solid State Electronics from the University of California, Davis, USA, in 2000. She began her career in Motorola's semiconductor division, which later became Freescale Semiconductor in 2004 and subsequently NXP Semiconductors in 2016. Her technical work focused on advanced ESD device modeling, failure mechanism analysis, and simulation to support product quality root-cause investigations. Her additional interests included EMC/ICIM behavioral modeling, substrate noise modeling, and predictive analysis for mixed-signal and RF SoC platforms. She is currently with NXP's Technology and Quality Solutions organization in Beijing, China, specializing in ESD compact modeling and SPICE level model development. She is also a member of the Si2 CMC ASM ESD diode model workgroup and the ESD FET model workgroup.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering and his M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. from the Department of Electrical and Computer Engineering at the University of Illinois Urbana-Champaign in 2015. He worked at NXP Semiconductors, Austin, TX, from 2015 to 2021. He has been with Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA development for SoC integration and ESD/latch-up design verification.

Lena Zeitlhoefler received her Master's degree in Electrical Engineering in 2017 from the Technical University of Munich (TUM). During her time as a Ph.D. student at TUM, she worked in collaboration with Infineon Technologies AG in the fields of ESD and, in particular, on the physics of CDM and CDM simulation. She is an active member in several standardization working groups. In recent years, she was a member of the TPC for the EOSESD Symposium and for IEW Europe and Asia, and mentored several publications. She joined the global ESD team at Infineon in Munich, Germany, full-time in 2021.

Friedrich zur Nieden received the Ph.D. degree in electrical engineering from TU Dortmund University, Germany, in 2014. From 2007 to 2012, he was a research and teaching assistant at the On-Board Systems Laboratory at TU Dortmund University. In 2010, he received a scholarship from the German Academic Exchange Service, which allowed him to stay at the University of Missouri Science and Technology in Rolla, Missouri, USA, where he continued his work in system-level ESD simulation. In 2012, he joined the central ESD department at Infineon Technologies AG in Munich, Germany. At Infineon, he works on ESD topics, focusing on characterization, device testing, ESD at the system level, and production support.

Mohamed Chefai received his Master's degree in Electrical Engineering from the Technical University of Munich (TUM) in 2022. After his studies, he joined the central ESD department of Infineon Technologies AG based in Munich, Germany. In his current position at Infineon, Mohamed works on ESD engineering with a strong focus on device testing.

David E. Swenson retired in 2003 after 35 years of service at 3M.  While at 3M, he was responsible for new static control packaging material development and application, training 3M personnel worldwide, and providing application assistance to users of static control products globally, with particular emphasis on Asia Pacific and Japan.  Dave and his wife, Geri, established a new company, Affinity Static Control Consulting, L.L.C., in 2003, and support clients around the world. Dave has been a member of the ESD Association since 1984 and has served in many capacities, including as the 1997 Symposium General Chair and as president of the Association in 1998 and 1999, and again in 2008 and 2009.  He is currently appointed to the Board of Directors to assist with technical inquiries. Dave was presented with the ESD Association's highest award, the “Outstanding Contributions Award,” in 2002. He is an original member of the ESDA Standards Committee, serving on many Working Groups and the ANSI/ESD S20.20 Task Team. He is a member of the Electrostatic Society of America and IMAPS, and is a retired US Expert on IEC TC101, Electrostatics, after serving for more than 20 years.

Kai has experience in the field of ESD and EOS for more than 25 years. He is Senior Principal for "Overvoltage robust design" in the Power and Sensor Solution business group of Infineon in Munich (Germany). In his role, he oversees the development of robustness concepts against electrically related threat scenarios at the IC and system levels. He also acts as a consultant at Infineon regarding EOS (better: EIPD)- related field returns, supporting root cause analysis. Kai contributes to the development of standard practice documents in the Automotive Industry, addressing semiconductor devices exhibiting signs of electrical overstress. These activities are in close cooperation with USCAR (United States Council for Automotive Research) and VDA (German Association of the Automotive Industry). 

Mohamed Chefai received his Master's degree in Electrical Engineering from the Technical University of Munich (TUM) in 2022. After his studies, he joined the central ESD department of Infineon Technologies AG based in Munich, Germany. In his current position at Infineon, Mohamed works on ESD engineering with a strong focus on device testing.

Kai has experience in the field of ESD and EOS for more than 25 years. He is Senior Principal for "Overvoltage robust design" in the Power and Sensor Solution business group of Infineon in Munich (Germany). In his role, he oversees the development of robustness concepts against electrically related threat scenarios at the IC and system levels. He also acts as a consultant at Infineon regarding EOS (better: EIPD)- related field returns, supporting root cause analysis. Kai contributes to the development of standard practice documents in the Automotive Industry, addressing semiconductor devices exhibiting signs of electrical overstress. These activities are in close cooperation with USCAR (United States Council for Automotive Research) and VDA (German Association of the Automotive Industry). 

David E. Swenson retired in 2003 after 35 years of service at 3M.  While at 3M, he was responsible for new static control packaging material development and application, training 3M personnel worldwide, and providing application assistance to users of static control products globally, with particular emphasis on Asia Pacific and Japan.  Dave and his wife, Geri, established a new company, Affinity Static Control Consulting, L.L.C., in 2003, and support clients around the world. Dave has been a member of the ESD Association since 1984 and has served in many capacities, including as the 1997 Symposium General Chair and as president of the Association in 1998 and 1999, and again in 2008 and 2009.  He is currently appointed to the Board of Directors to assist with technical inquiries. Dave was presented with the ESD Association's highest award, the “Outstanding Contributions Award,” in 2002. He is an original member of the ESDA Standards Committee, serving on many Working Groups and the ANSI/ESD S20.20 Task Team. He is a member of the Electrostatic Society of America and IMAPS, and is a retired US Expert on IEC TC101, Electrostatics, after serving for more than 20 years.