2026 Steering Committee

Strategy Chair - Gianluca Boselli, Texas Instruments

General Chair - James DiSarro, Texas Instruments

Vice General Chair - Alain Loiseau, GLOBALFOUNDRIES

Technical Program Committee Chair - Slavica Malobabic, Cirrus Logic

Workshop Chair - Marko Simicic, imec

 

2026 TPC

Advanced CMOS (Analog/Digital) EOS/ESD and Latchup, ESD Protection in Bipolar, RF, High Voltage and BCD Technologies

Rebello Alwyn GlobalFoundries
Mahajan Prantik Renesas
Kazuki Shimada Renesas
Bourgeat Johan STMicroelectronics
Dissegna Mariano TI
Chen4 Wen-Chieh IMEC
Parthasarathy Srivatsan Analog
Orr Benjamin Intel

Numerical Modeling and Simulation for On-Chip ESD Protection and Chip/Module/Package EOS/ESD Electronic Design Automation

Shibkov Andrei Angstrom Design automation
Meng Kuo-Hsuan Silicon Labs
Vashchenko Vladislav Analog
Gallerano Antonio TI
Rosenbaum Elyse UIUC
Aharoni Efraim Tower Semiconductor
Hogan Matthew Siemens EDA

EOS/ESD Failure Analysis, Troubleshooting and Case Studies

Di Biccari Leonardo STMicroelectronics
Kontos Dimitrios Analog
Concannon Ann TI
Okushima Mototsugu Renesas
Chen Chen AMD
Scholz Mirko Infineon

Device Testing: Testers, Methods and Correlation Issues

Boroni Andrea STMicroelectronics
Muhonen Kathy Qorvo
O'Sullivan Greg Micron
Maloney Tim Center for Analytic Insights
Verwoerd Sheela  NXP
Johnsson David HPPI
Ashton Robert -

System Level EOS/ESD/EMC, HMM

Kunz Hans TI
Willemen Joost Infineon
Shringarpure Ketan Google
Spray Andrew Synaptics
Marathe Shubhankar Amazon
Peng1 Zhekun Apple
Tamminen Pasi Danfoss

EOS/ESD in Manufacturing

Fung Rita Cisco
Yoo Joshua Core Insight
Nold Andy Teradyne
Skolnik Jay Skolnik Technical
Viheriäkoski Toni Cascade Metrology
Merkel Ellen Fraunhofer