Agenda

Gianluca Boselli earned his MS in EE from the University of Parma (1996) and PhD from the University of Twente (2001). He joined Texas Instruments in 2001, focusing on ESD and latch-up for CMOS technologies. He currently manages TI's corporate ESD Team and directs the Advanced Technology Development University Research Program. A prolific author and speaker, he has received multiple best paper awards and the prestigious ESD Association Outstanding Contribution Award (2019). He holds 20+ patents, serves on the EOS/ESD Association Board of Directors as Chief Strategist, and is an IEEE Senior Member.

Mohamed Chefai received his Master's degree in Electrical Engineering from the Technical University of Munich (TUM) in 2022. After his studies, he joined the central ESD department of Infineon Technologies AG based in Munich, Germany. In his current position at Infineon, Mohamed works on ESD engineering with a strong focus on device testing.

Wen-Chieh Chen received the B.S and M.S. degrees in electronics engineering from National Chiao-Tung University, Hsinchu, Taiwan, in 2016 and 2018, respectively, and the Ph.D. degree from the Electrical Engineering Department (ESAT), Katholieke Universiteit Leuven (KU Leuven), Leuven, Belgium, in 2024. She joined the ESD team, imec, Leuven, Belgium, in 2019. Her current research interests include mixed-voltage I/O design and ESD characterization in advanced sub-5-nm technologies, 3D/2.5D ICs, and the DTCO/STCO scaling roadmap. 

Tzu-Hao Chiang received the B.S. degree in electrical engineering and the M.S. degree in electronic engineering from National Taiwan University, Taipei, Taiwan, in 2020. He joined Taiwan Semiconductor Manufacturing Company (TSMC) in 2020, where he is currently a senior engineer in the ESD/EOS Technology Department. His work focuses on single-event latch-up (SEL) and ESD victim design solution development.

Mahdi Elghazaki received his PhD in 2017 from the University of Waterloo, ON, Canada. He joined Intel in October 2018, and since then, he has been part of the ESD and LU quality and reliability team, working to ensure the ESD robustness of Intel's new technology nodes. 

Jehoon Lee received his B.S., M.S., and Ph.D. degrees in Electronic and Electrical Engineering from Dankook University (DKU), Korea, in 2016, 2018, and 2023, respectively. He is currently with the ESD/TCAD Team at DBHiTek. His research focuses on ESD protection design in BCD, CIS, LDI, and other processes, as well as TCAD-based device analysis.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering and his M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. from the Department of Electrical and Computer Engineering at the University of Illinois Urbana-Champaign in 2015. He worked at NXP Semiconductors, Austin, TX, from 2015 to 2021. He has been with Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA development for SoC integration and ESD/latch-up design verification.

Wolfgang Stadler is a consultant specializing in electrostatic discharge (ESD) and electrical overstress (EOS), with 30 years of experience in both areas. He is the co-founder and co-owner of Gärtner & Stadler ESD Consulting GmbH & Co. KG. He actively participates in the EOS/ESD Association and IEC working groups focused on ESD control and process assessment. Wolfgang is co-chair of the ESDA business unit "Standardization". Wolfgang is appointed to the Board of Directors of the EOS/ESD Association. In 2019, he received the Outstanding Contribution Award from the EOS/ESD Association, and in 2021, the Joel P. Weidendorf Award for his significant contributions to the development of EOS/ESD standards. He is a member of the German National Committee DKE/K 185 and has served as Secretary of IEC TC101 since January 2026. Since 2015, he has been serving as president of the German ESD FORUM e.V.

Michael "Michi" Stockinger received his PhD in electrical engineering with highest honors from Vienna University, Austria, in 2000. His doctoral research focused on the optimization of ultra-low-power CMOS transistors. In 2000, he joined Motorola's semiconductor sector, which became Freescale Semiconductor in 2004 and NXP Semiconductors in 2016. Michael is currently a Technical Director with NXP's Analog Competence Center located in Austin, Texas, focusing on ESD protection and LU prevention for advanced CMOS products. His on-chip ESD solutions have been implemented in the Kinetis, i.MX, ColdFire, and MCX product lines. Michael was awarded several EOS/ESD Symposium awards: 2001 Best Paper, 2003 Best Paper & Best Presentation, 2013 Best Paper & Outstanding Paper, and 2020 Best Paper. He received the 2023 Industry Pioneer Recognition Award by the ESD Association. Michael has authored over 40 technical papers and holds 34 patents. He has served in the TPCs of several EOS/ESD Symposia, International Reliability and Physics Symposia, and International ESD Workshops, and has taught several ESDA tutorials and online courses. Michael is chair of the JEDEC JESD78 latch-up testing workgroup and Si2's CMC ASM-ESD diode model workgroup.

David E. Swenson retired in 2003 after 35 years of service at 3M.  While at 3M, he was responsible for new static control packaging material development and application, training 3M personnel worldwide, and providing application assistance to users of static control products globally, with particular emphasis on Asia Pacific and Japan.  Dave and his wife, Geri, established a new company, Affinity Static Control Consulting, L.L.C., in 2003, and support clients around the world. Dave has been a member of the ESD Association since 1984 and has served in many capacities, including as the 1997 Symposium General Chair and as president of the Association in 1998 and 1999, and again in 2008 and 2009.  He is currently appointed to the Board of Directors to assist with technical inquiries. Dave was presented with the ESD Association's highest award, the “Outstanding Contributions Award,” in 2002. He is an original member of the ESDA Standards Committee, serving on many Working Groups and the ANSI/ESD S20.20 Task Team. He is a member of the Electrostatic Society of America and IMAPS, and is a retired US Expert on IEC TC101, Electrostatics, after serving for more than 20 years.

Johan received his PhD in 2011, specializing in innovative ESD (Electrostatic Discharge) devices in the C28SOI node. He joined STMicroelectronics, where he has dedicated his expertise to developing new SCR-based ESD solutions. Over the years, Johan has been responsible for advancing ESD protections for analog, RF, and high-voltage applications, as well as addressing latch-up issues in CMOS, Bi-CMOS, and PIC technologies.
He is currently an active member of the technical staff community and serves on the ESD/EOS/EMC/Latch-Up Steering Committee. Recently, he has taken on the leadership role of the TDP/IPLD ESD Team based in Crolles. Johan is also an innovative contributor to the field, regularly filing patents and publishing at various scientific conferences.

Steffen Holland received his PhD in Physics from the University of Hamburg. He joined Nexperia's bipolar process development group in Hamburg, Germany, in 2005. The focus of his work quickly became TCAD process and device simulations for discrete ESD protection devices. He now works on TVS protection devices. His interests are system-level ESD simulations, and he is chair of the ESDA working group 26. He serves on the Board of Directors at the ESDA.

Ruoyu Hu is currently working as a reliability engineer at Amazon. Ruoyu received his PhD from the University of Southampton, with a major in Bioelectronic Sensors. Before that, he earned his Master of Engineering degree in electronics from the University of Edinburgh. He was awarded a Bachelor's degree in Electronic Engineering and Automation from Beijing Institute of Technology. Ruoyu worked at Neuron Network on CV-related research and on their automation application at Amazon. He also dives deep into ESD-related research and protection methodology related to tests.

Jun‑Bae Kim holds a Ph.D. in electrical engineering and is a Principal Engineer at Samsung Electronics with over 20 years of experience in DRAM circuit design and reliability. He spent more than a decade on DRAM I/O, high‑speed interface, and signal‑integrity design, then transitioned to system‑level ESD engineering, investigating ESD‑induced failures in high‑speed memory and EMI mitigation for mobile DRAM. Since 2024, he has tackled ESD challenges in stacked‑DRAM packaging and manufacturing. His current research focuses on system‑level ESD, the charged‑device model (CDM), and ESD‑aware design methodologies.

Hans Kunz joined Texas Instruments in 2003, after nine years at Dallas Semiconductor/Maxim, and was elected Distinguished Member of Technical Staff in 2017. His past responsibilities include designing, developing, and implementing ESD protection circuits for analog CMOS and high-voltage BiCMOS technologies, as well as developing ESD verification tools and methodologies.  Hans is currently focused on developing test, measurement, and design methodologies for system-level ESD protection at the IC level.  Hans is a co-author of multiple publications on ESD and received the Best Presentation Award at the 2006 EOS/ESD Symposium. He holds 13 patents.

Martin holds a diploma* in Computer Engineering from Mannheim University. He joined Philips Semiconductors in 2005 and has since then worked in several product design and application marketing roles for NXP and Nexperia. Martin is currently responsible for worldwide product application support of Nexperia's ESD Protection and Filtering portfolio with a focus on mobile, portable, consumer, and computing applications.

Hsin-Cheng Su received a B.S. degree from the Department of Electronics and Electrical Engineering, National Yang-Ming Chiao Tung University (NYCU), Hsinchu, Taiwan, in 2025. Currently, he is a Master student in the Institute of Electronics, National Yang Ming Chiao Tung University (NYCU), Hsinchu, Taiwan. His research interests include analog circuit design and ESD protection circuit design. 

Dr. Vladislav Vashchenko has been the Sr. Director, Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latch-up IC co-design business process and technology development. Previously, he managed ESD technology development at National Semiconductor (2000-2011). He received an MS Engineer-Physicist (1987), a Ph.D. in Physics of Semiconductors from MIPT (1990), and a "Doctor of Science in Microelectronics" habilitation degree (1997). He is the author of 150 U.S. patents, over 120 papers, and co-author of three books in the ESD field.

Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He specializes in electrostatics and ESD risk analysis across healthcare, medical, electronics, automotive, and process industries through his company, Cascade Metrology. He has authored over 30 publications on electrostatics and ESD. Toni serves as Chair of the Finnish STAHA Association and the Standardization Committee SK101, and contributes to IEC TC101 and the EOS/ESD Association workgroups. He received the IEC 1906 Award in 2019, the EOS/ESD Association Outstanding Paper Award in 2022, the Best Paper Award as co-author in 2023, and an international fellow award in Electrostatics in 2025.

Heinrich Wolf received his PhD from the Technical University of Berlin, Germany. In 1999, he joined the Munich branch of the Fraunhofer Institute for Reliability and Microintegration (IZM), which became the Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT. In his role as an expert in test and measurement, he became chief scientist at the EMFT and co-leads the Test of Electronic and Quantum Systems (TEQ) group. He also co-chairs the CDM Joint Working Group in the standardization body of the ESD Association, and represents the German ESD-Forum in the standards working groups.

Friedrich zur Nieden received the Ph.D. degree in electrical engineering from TU Dortmund University, Germany, in 2014. From 2007 to 2012, he was a research and teaching assistant at the On-Board Systems Laboratory at TU Dortmund University. In 2010, he received a scholarship from the German Academic Exchange Service, which allowed him to stay at the University of Missouri Science and Technology in Rolla, Missouri, USA, where he continued his work in system-level ESD simulation. In 2012, he joined the central ESD department at Infineon Technologies AG in Munich, Germany. At Infineon, he works on ESD topics, focusing on characterization, device testing, ESD at the system level, and production support.

Alwyn Rebello received an M.Sc. degree in Physics from Cochin University of Science and Technology, Kerala, India, in 2005, and a Ph.D. degree from the National University of Singapore (NUS), Singapore, in 2011. In 2017, he joined GLOBALFOUNDRIES in Singapore, where he is involved in the development of ESD and Latchup protection for technology nodes ranging from 0.18 μm to 28nm. His current research interests include ESD device development and latch-up prevention for various automotive and RF applications. 

After receiving his Ph.D. from the Eindhoven University of Technology with a thesis on compact device modeling, Theo Smedes worked at the Delft University of Technology on layout-to-circuit extraction. In 1995, he joined NXP Semiconductors (then Philips Semiconductors), working on tools for statistical design. Currently, he is an NXP Fellow for ESD and Latch-up. Theo is a member of all ESDA device testing working groups and chairs the TLP working group. He published several papers on ESD and received the 2007 Best Paper Award and the 2009, 2018, and 2022 Outstanding Paper Award of the EOS/ESD Symposium. Theo was the general chair of the EOS/ESD Symposium in 2013. He has been recognized with ESDA's David F. Barber Sr. Memorial Award (2017) and Outstanding Contribution Award (2022).

Nandha Kumar  Subramani received his PhD in Electronics Engineering from the Université de Limoges, France, in 2017, and his master's degree in Electrical and Electronics Engineering from the University of Sheffield in 2014. He has worked for GLOBALFOUNDRIES on ESD devices development and characterization, and TCAD device modeling. He has authored or co-authored several publications in the fields of GaN trap characterization, low-frequency noise measurements, TCAD-based physical simulations, and ESD device development.

Dr. Vladislav Vashchenko has been the Sr. Director, Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latch-up IC co-design business process and technology development. Previously, he managed ESD technology development at National Semiconductor (2000-2011). He received an MS Engineer-Physicist (1987), a Ph.D. in Physics of Semiconductors from MIPT (1990), and a "Doctor of Science in Microelectronics" habilitation degree (1997). He is the author of 150 U.S. patents, over 120 papers, and co-author of three books in the ESD field.

Lena Zeitlhoefler received her Master's degree in Electrical Engineering in 2017 from the Technical University of Munich (TUM). During her time as a Ph.D. student at TUM, she worked in collaboration with Infineon Technologies AG in the fields of ESD and, in particular, on the physics of CDM and CDM simulation. She is an active member in several standardization working groups. In recent years, she was a member of the TPC for the EOSESD Symposium and for IEW Europe and Asia, and mentored several publications. She joined the global ESD team at Infineon in Munich, Germany, full-time in 2021.

Friedrich zur Nieden received the Ph.D. degree in electrical engineering from TU Dortmund University, Germany, in 2014. From 2007 to 2012, he was a research and teaching assistant at the On-Board Systems Laboratory at TU Dortmund University. In 2010, he received a scholarship from the German Academic Exchange Service, which allowed him to stay at the University of Missouri Science and Technology in Rolla, Missouri, USA, where he continued his work in system-level ESD simulation. In 2012, he joined the central ESD department at Infineon Technologies AG in Munich, Germany. At Infineon, he works on ESD topics, focusing on characterization, device testing, ESD at the system level, and production support.