Agenda

Welcome to the official opening of the 2026 EOS/ESD Symposium.

Collecting and labeling real-world lab data is expensive and time-consuming. The traditional supervised-learning paradigm, whether for fault classification, device characterization, or fault-cause prediction, will not perform well when there is insufficient labeled data to train a reliable model. AI model training will be even more challenging when the application spans multiple technology nodes and devices, with unique impacts of process variations on ESD behavior. We will first review machine learning techniques well-suited for handling limited or imbalanced data. We, then more specifically, discuss a scalable transfer learning framework utilizing (i) a TCAD simulation model calibrated against a lab-measured device, and (ii) a neural network classifier pre-trained using TCAD simulation data and fine-tuned using the lab-measured data. This framework correlates various abnormalities to device physical variations, providing a deeper insight into design/process parameters and ESD window boundaries that can influence TLP variations.

More details to be announced.

Join us for lunch and the presentation of the 2025 Best Paper and Outstanding Paper Awards.

Electrostatic Discharge (ESD) protection has become more critical and complex in advanced CMOS design. This session provides a comprehensive year-in-review of the evolving ESD protection landscape, tracing the roadmap from FinFET to the Gate-All-Around (GAA) era, as well as the back-side power delivery network (BSPDN). The most impactful literature in recent years will be shared, synthesizing ESD protection strategies across multiple domains. The review emphasizes device-level optimizations in diodes and SCRs, alongside circuit-level innovations and the shift toward Design-Technology Co-Optimization (DTCO) strategies.

Join us as we open the second day of the EOS/ESD Symposium.

Designing for harsh environments requires a shift in perspective: good electrical latchup (ELU) performance is necessary, but in most cases, it is NOT sufficient! This talk bridges the gap between standard electrical reliability and the realities of radiation-induced failures. We will examine the salient features of the space radiation environment—including the impact of solar activity and orbital shielding on satellite electronics—and follow the "cascade" of these particles as they interact with the Earth’s atmosphere and magnetic field to create the terrestrial radiation events that plague the reliable operation of aircraft and critical ground-based infrastructure.  By comparing traditional ELU with the more destructive Single Event Latchup (SEL) effect, we will demonstrate why standard technologies and design rules often fall short. Attendees will leave with a clear understanding of the design "tweaks" and process-level mitigations essential for hardware destined for extreme environments, as well as how SEL is characterized using heavy-ion beam testing to determine whether a specific design or IC meets the required reliability performance.

This paper presents a comprehensive overview of local MOS-based ESD protection structures for open-drain applications. These different structures are described and compared based on silicon characterization. They have been integrated into different original ESD networks in 40nm technology.

The effect of miscorrelation between the protection of local high-impedance control and HV power pins using NLDMOS-SCR is studied both experimentally and through mixed-mode simulation. It is demonstrated that the phenomenon results from internal circuit discharge due to a fast NLDMOS-SCR switching into a low-voltage state.

Join us for the opening of the final day of the Symposium.

Demand for moving data continues to grow rapidly.  The massive scale of modern large language models has led to an exponential increase in connectivity requirements within data centers, creating challenging scenarios for both training and inference.  As users move closer, 5G networks are becoming saturated, with new deployments of massive MIMO needed to expand capacity without increasing costs or power consumption.  This talk will explore these high-speed applications, with a particular focus on optical networking within data centers and radio units within base stations.  New integrated circuit solutions will be discussed, with a focus on the challenges of protecting their interfaces as they move toward wider bandwidth and higher dynamic range. 

Capacitively Coupled-Transmission Line Pulse (CC-TLP) is discussed as an alternative CDM testing method. In contrast to Field Induced CDM testing, the Contact Pulsed testing method can be used, apart from packaged products, on bare die and wafer level. Using TLP as a pulse source enables control over stress parameters, such as risetime and pulse width, at both very low and very high stress levels. The CDM JWG is currently working towards a CC-TLP standard testing method to enable testing of future products, e.g., in the chiplet business. 

Measuring electric fields, potentials, and charges is fundamental to electrostatics. These metrics allow engineers to analyze charge behavior, evaluate materials, and assess hazards. This talk covers core principles and techniques for characterizing these properties. We will explore selecting appropriate instrumentation, operating equipment, and analyzing collected data, including coulombmeters, fieldmeters, electrostatic voltmeters, and resistivity measurements.

The global converting industry, valued at approximately $46 billion USD in 2026, processes paper, film, and foil materials into finished products. During these operations, electrostatic charge accumulation can create significant safety and production challenges, including worker injuries from electrical shocks, ignition of fires from sparks, damage to sensitive products, and material-handling issues such as sticking and jamming. Effective static control minimizes these risks and maintains reliable manufacturing performance. Accurate measurement of electrostatic charge levels enables both the diagnosis of static-related problems and the verification of static dissipator performance. In addition, understanding the operating principles of static dissipaters enables proper installation and effective charge neutralization. Part 1 of this presentation reviews the fundamentals of electrostatic fieldmeter measurements and the operating mechanisms of static dissipaters used in converting applications.

Review of the potential for Static Electricity and the hazards presented when mixing, handling, and transferring/loading flammable materials. Review of the options (levels of protection) available in the market for controlling static electricity from proper simple mechanical clamps to monitoring systems with visual indication and monitoring systems with visual indication and interlocks for process control. Process control, in the form of Interlocks for safety equipment, offers the greatest protection against human error. Review of additional technology offered via Road Tanker Recognition to ensure that operators cannot circumvent proper grounding practice.

The Electrostatics and Surface Physics Laboratory at the NASA Kennedy Space Center has developed an astronaut hand tool that can remove dust from astronaut suits prior to egress into the habitat for upcoming Lunar missions for the Artemis Program. In addition to dust removal, the Lunar Electrostatics and Dust Mitigation (LEDM) tool uses ionized nitrogen gas to remove electrostatic charges from the suit. This system is based on commercial air ionization equipment suited for lunar applications.

The shift to 2.5D/3D-ICs increases ESD verification cost and complexity. This work develops an environment that automates the extraction of optimal resistance checks from bump layouts, reducing verification time. Visualization of results highlights layout weaknesses, enabling efficient design improvements for large-scale 2.5D/3D-ICs.

Join us for the official closing of the 2026 EOS/ESD Symposium.

The EOS/ESD Association Technical Standards Summit brings together industry leaders, technology innovators, manufacturers, standards developers, and end users to identify emerging ESD and reliability challenges, assess gaps in current standards, and define priorities that will guide the evolution of industry standards for next-generation electronics technologies.

1. Identify Emerging Technology Challenges Impacting ESD and Reliability
2. Assess Gaps in Existing Standards and Industry Practices
3. Define Industry Priorities for Future Standards Development
4. Improve Alignment Between Technology Roadmaps and Standards Development
5. Strengthen Collaboration Across Industries
6. Improve the Link Between Manufacturing Reality and Standards Requirements
7. Establish a Vision for Ultra-Sensitive Device Manufacturing
8. Accelerate Standards Evolution

Energetic materials—including explosives, propellants, pyrotechnics, and other electrostatic discharge-sensitive materials—present some of the most demanding ESD control challenges of any industry. Unlike semiconductor manufacturing, where ESD events may damage devices, electrostatic discharge in energetics can have immediate safety consequences for personnel, facilities, and mission-critical operations.

As manufacturing technologies, automation, advanced materials, and global supply chains evolve, the standards industry has an opportunity to ensure ESD guidance remains current, practical, and harmonized across commercial, defense, aerospace, and government applications.

What does the energetics community need from the standards industry to improve safety, consistency, and implementation over the next decade?

Aerospace and military systems have some of the longest product life cycles of any industry, often exceeding 20–40 years. Increasing electronics density, advanced packaging, and heterogeneous integration are creating new ESD and latch-up risks. Supply chain globalization and component obsolescence continue to challenge qualification and reliability efforts. Mission-critical applications require extremely high confidence in standards, test methods, and compliance processes.

If the EOS/ESD Association could deliver one new standard, technical report, or industry initiative over the next three years that would provide the greatest value to aerospace and military organizations, what should it be?

Traditional ESD control programs were developed when devices were significantly more robust. Advanced packaging technologies are driving unprecedented CDM sensitivity. 2.5D heterogeneous integration introduces multiple handling points, suppliers, and assembly processes. The industry is moving toward a point where prevention—not qualification testing—is the primary defense.

How can manufacturing successfully control ESD when devices are approaching or below 5V CDM sensitivity?

Foundries are at the forefront of technology development and often see ESD challenges years before products reach volume manufacturing. As device geometries shrink, advanced packaging proliferates, and heterogeneous integration becomes the norm, foundries need clear guidance on future ESD expectations to make informed process, design, and investment decisions.

How can the EOS/ESD Association Technology Roadmap better support foundries in preparing for the next generation of ESD challenges?

The automotive industry is undergoing one of the most significant technology transformations in its history. Electrification, autonomous driving, advanced driver assistance systems (ADAS), software-defined vehicles, high-speed communications, and increasingly complex semiconductor content are creating new ESD and reliability challenges. While automotive has historically relied on a combination of industry standards, OEM specifications, and supplier requirements, many stakeholders believe current standards are struggling to keep pace with technology evolution.

What gaps exist in today's ESD and reliability standards, and what does the automotive industry need from standards organizations over the next 5–10 years?

As semiconductor manufacturing moves toward greater automation and device sensitivities continue to decline, the role of manufacturing equipment in ESD control has become increasingly critical. Many organizations invest heavily in ESD control programs, yet a significant portion of ESD risk originates from automated handling equipment, assembly tools, robotics, conveyors, and test systems. Today, there is often no universally accepted certification framework that demonstrates a tool is truly suitable for handling increasingly sensitive devices.

What standards, performance criteria, and certification processes should be used to qualify automated manufacturing and assembly tools for ESD-sensitive production environments?

The challenges facing ESD and reliability engineers today no longer fit neatly within a single industry. Semiconductor manufacturers, automotive OEMs, aerospace contractors, medical device companies, consumer electronics manufacturers, foundries, OSATs, equipment suppliers, and materials providers are all confronting similar issues:

• Advanced packaging and heterogeneous integration
• Ultra-low CDM robustness
• Increasing system complexity
• AI and high-performance computing applications
• Electrification and autonomous systems
• Supply chain fragmentation
• Faster technology development cycles

No single industry can solve these challenges alone.

How can industries collaborate more effectively to develop the next generation of ESD and reliability standards that are both technically robust and broadly applicable?

As the electronics industry advances into an era of heterogeneous integration, AI hardware, advanced packaging, electrification, autonomous systems, and ultra-sensitive semiconductor devices,  there is increasing pressure to create new standards. However, many stakeholders believe that significant value can still be realized by strengthening, modernizing, and expanding existing standards before developing entirely new ones. 

How should the standards community prioritize improving existing ESD and reliability standards to ensure they remain relevant, practical, and effective for future technologies?

By the conclusion of the Summit, participants should aim to produce:

1. Top 10 Emerging ESD and Reliability Challenges
2. Priority Standards Gap Analysis
3. Recommendations for the ESDA Technology Roadmap\
4. Cross-Industry Collaboration Opportunities
5. Future Manufacturing Readiness Assessment
6. Recommended Standards and Technical Report Initiatives
7. Strategic Input for EOS/ESD Association Standards Committees

Together, we will build what's next.