Agenda

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011. Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering and Physics and a master’s in Engineering Mechanics. Outside of work, Andy likes to spend time with his wife and kids.

John graduated from the University of Buffalo with a BS in Electrical Engineering and a master’s in electrical engineering from Syracuse University. John was hired by IBM, where he worked for 46 years. As part of his role, John was IBM's Subject Matter Expert in ESD control. This included developing and implementing ESD control processes at all the IBM manufacturing sites and assessing IBM’s suppliers for ESD control. The processes included wafer fab to large servers with all the processes required in between.
John has been a part of the ESD Association for over 30 years. He is currently chair of Working Group 20, which is responsible for ANSI/ESD S20.20, Development of an Electrostatic Discharge Control Program. John is also a member of various other standards working groups. He is also a founding member of the Technical Advisory Support Committee (TAS), which oversees all the standards of the ESD Association. John holds the position of Sr. Technical Director for EOS/ESD Association, Inc. John is the chair of the International Electrotechnical Commission (IEC) Technical Committee 101 on electrostatics. John is also the project leader for IEC 61340-5-1 – Electrostatic Discharge Control Program. Before becoming the chair, John was the chief delegate for the United States.
John’s accomplishments include several patents, Certified ESD Program Manager, Certified iNARTE ESD Engineer, Reliability Center of Japan – Chief ESD Coordinator, Outstanding Contribution Award (ESD Association), Outstanding Technical Achievement Award (IBM), 1906 Award (IEC), and many more.

Olivier Marichal graduated from Katholieke Universiteit Leuven with a degree in Electrical Engineering in 2003 and has since dedicated his career to the field of Electrostatic Discharge (ESD) protection design, currently serving as Chief Engineering at Sofics. His journey with the company began shortly after graduation as an ESD engineer, and over the years, Olivier has worked on many projects, covering a broad range of technologies from High Voltage BCD to the latest nanometer Finfet and GAAFet processes. His professional focus is on continuously adding value to customers through his work, delivering state-of-the-art ESD solutions for the ever evolving landscape of semiconductor applications.  Olivier has (co-)authored several papers on ESD and contributed as an inventor on many patents. In addition to his technical contributions, Olivier is dedicated to sharing his knowledge and insights. He has conducted several tutorials on on-chip ESD protection design for industry professionals around the world.

Doug Smith received a B.E.E.E. degree from Vanderbilt University in 1969 and an M.S.E.E. degree from the California Institute of Technology in 1970. In 1970, he joined AT&T Bell Laboratories as a Member of Technical Staff. He retired in 1996 as a Distinguished Member of Technical Staff. From February 1996 to April 2000 he was Manager of EMC Development and Test at Auspex Systems in Santa Clara, CA. Mr. Smith currently is an independent consultant specializing in high frequency measurements, circuit/system design and verification, switching power supply noise and specifications, EMC, and immunity to transient noise. He is a Senior Member of the IEEE and a former member of the IEEE EMC Society Board of Directors.
His technical interests include high frequency effects in electronic circuits, including topics such as Electromagnetic Compatibility (EMC), Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and other forms of pulsed electromagnetic interference. He also has been involved with FCC Part 68 testing and design, telephone system analog and digital design, IC design, and computer simulation of circuits. He has been granted over 15 patents, several on measurement apparatus.
Mr. Smith holds the title of University of Oxford Tutor in the Department of Continuing Education at Oxford University in the UK. He has lectured at Oxford University, The University of California Santa Barbara, The University of California Berkeley, Vanderbilt University, AT&T Bell Labs, and internationally at many public and private seminars on high frequency measurements, circuit design, ESD, and EMC. He is author of the book High Frequency Measurements and Noise in Electronic Circuits. His very popular website, http://emcesd.com (www.dsmith.org), draws many thousands of visitors each month to see over 250 technical articles as well as other features.
He provides training and consulting services in general design, EMC, and transient immunity (such as ESD and EFT), and switching power supply noise. His specialty is solving difficult problems quickly, usually within a couple of days. His work has included digital and analog circuits in everything from large diesel powered machinery to space craft to IC chip level circuits. His large client base includes many well known large electronic and industrial companies as well as medium sized companies and start-up companies.

Tom Ricciardelli received a SB and SM in Chemical Engineering from MIT in 1985 and an MBA from the Sloan School of Management in 1991.  In 1993, he founded SelecTech with the mission of creating valuable products from recycled materials.   He has over 20 years experience with developing unique polymer blends to meet demanding technical requirements and holds several patents for products and processes using recycled materials.  He was the first to conceive of and develop an adhesive-free, interlocking static-control flooring system which paved the way for the StaticStop line of industry-leading ESD flooring products.
With this product, he was flung headlong into the ESD industry and joined the ESD Association in 2013 to become more involved in the industry and better understand the full needs of his customers.  He is now the chair of WG 7 and a member of WG19, WG97, and the Marketing Communications committees.  “While I have a strong engineering background with degrees in chemical engineering, my knowledge of electronics and ESD was certainly limited.  Being involved in the ESD association, through the committees, the available training information, and generous support from other members, I’ve learned a vast amount about ESD and its control.  I particularly enjoy networking with the other members, working with them on the committees, and having a little fun during the free time.”  

Jay Skolnik is a licensed professional electrical engineer and is the co-founder and lead engineer/ consultant of Skolnik Technical Training in Albuquerque, NM. With over thirty years of experience in the electronics industry, Jay has developed a multitude of products utilized in different industries, including military, defense, avionics, aerospace, commercial, industrial, medical, automotive, and sports entertainment. As an ESDA certified program manager, Jay teaches ESD mitigation and control for the electronics and energetics specialties. He performs ESD audits to ensure factories and laboratories are following safe ESD control guidelines and procedures. He is also certified by iNARTE and is a certified professional instructor of national instruments (NI). He received his electrical engineering degree from the University of Missouri-Rolla.

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011. Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering and Physics and a master’s in Engineering Mechanics. Outside of work, Andy likes to spend time with his wife and kids.

David E. Swenson retired in 2003 after 35 years of service from 3M.  While at 3M he had responsibility for new packaging material development and application, training of 3M personnel worldwide and providing application assistance to users of static control products globally with particular emphasis on Asia Pacific and Japan.  Dave and his wife Geri established a new company, Affinity Static Control Consulting, L.L.C .in 2003. Dave has been a member of the ESD Association since 1984 and has served in many capacities including 1997 Symposium General Chair and president of the Association in 1998 and 1999 and again in 2008 and 2009.  He was re-elected to the Board of Directors for a 5th term from 2014 to 2016 and is currently appointed to the Board to assist with technical inquiries. Dave was presented with the highest award of the ESD Association, the “Outstanding Contributions Award” in 2002, the Standards Committee “Joel P. Weidendorf Memorial Award” in 2004, the Association “Edward G. Weggeland” Memorial Award in 2014 and the Symposium Committee’s, David Barber, Sr. Memorial award in 2018.  He is a member of the Standards Committee serving several Working Groups and the ANSI/ESD S20.20 Standard Task Team.   Dave also serves as Treasurer and Information Liaison of the Texas Chapter of the ESD Association; he is a member of the Electrostatic Society of America, IMAPS, the UK Institute of Physics and is a US Expert to IEC TC101, Electrostatics. 

Wim Vanhouteghem is a Senior ESD Design Engineer and the head of the measurement lab at Sofics. A 2007 graduate of KHBO - now part of the Catholic University of Leuven, Wim joined Sofics immediately after completing his studies. His work primarily focuses on ESD protection in semiconductor technologies, ranging from high voltage BCD to FinFETs.  Wim has plenty of experience in implementing ESD protection and conducting ESD measurements. He contributed to the SEED concept and has worked on system-level ESD measurements on bare dies. 

Jay Skolnik is a licensed professional electrical engineer and is the co-founder and lead engineer/ consultant of Skolnik Technical Training in Albuquerque, NM. With over thirty years of experience in the electronics industry, Jay has developed a multitude of products utilized in different industries, including military, defense, avionics, aerospace, commercial, industrial, medical, automotive, and sports entertainment. As an ESDA certified program manager, Jay teaches ESD mitigation and control for the electronics and energetics specialties. He performs ESD audits to ensure factories and laboratories are following safe ESD control guidelines and procedures. He is also certified by iNARTE and is a certified professional instructor of national instruments (NI). He received his electrical engineering degree from the University of Missouri-Rolla.

David E. Swenson retired in 2003 after 35 years of service from 3M.  While at 3M he had responsibility for new packaging material development and application, training of 3M personnel worldwide and providing application assistance to users of static control products globally with particular emphasis on Asia Pacific and Japan.  Dave and his wife Geri established a new company, Affinity Static Control Consulting, L.L.C .in 2003. Dave has been a member of the ESD Association since 1984 and has served in many capacities including 1997 Symposium General Chair and president of the Association in 1998 and 1999 and again in 2008 and 2009.  He was re-elected to the Board of Directors for a 5th term from 2014 to 2016 and is currently appointed to the Board to assist with technical inquiries. Dave was presented with the highest award of the ESD Association, the “Outstanding Contributions Award” in 2002, the Standards Committee “Joel P. Weidendorf Memorial Award” in 2004, the Association “Edward G. Weggeland” Memorial Award in 2014 and the Symposium Committee’s, David Barber, Sr. Memorial award in 2018.  He is a member of the Standards Committee serving several Working Groups and the ANSI/ESD S20.20 Standard Task Team.   Dave also serves as Treasurer and Information Liaison of the Texas Chapter of the ESD Association; he is a member of the Electrostatic Society of America, IMAPS, the UK Institute of Physics and is a US Expert to IEC TC101, Electrostatics. 

David E. Swenson retired in 2003 after 35 years of service from 3M.  While at 3M he had responsibility for new packaging material development and application, training of 3M personnel worldwide and providing application assistance to users of static control products globally with particular emphasis on Asia Pacific and Japan.  Dave and his wife Geri established a new company, Affinity Static Control Consulting, L.L.C .in 2003. Dave has been a member of the ESD Association since 1984 and has served in many capacities including 1997 Symposium General Chair and president of the Association in 1998 and 1999 and again in 2008 and 2009.  He was re-elected to the Board of Directors for a 5th term from 2014 to 2016 and is currently appointed to the Board to assist with technical inquiries. Dave was presented with the highest award of the ESD Association, the “Outstanding Contributions Award” in 2002, the Standards Committee “Joel P. Weidendorf Memorial Award” in 2004, the Association “Edward G. Weggeland” Memorial Award in 2014 and the Symposium Committee’s, David Barber, Sr. Memorial award in 2018.  He is a member of the Standards Committee serving several Working Groups and the ANSI/ESD S20.20 Standard Task Team.   Dave also serves as Treasurer and Information Liaison of the Texas Chapter of the ESD Association; he is a member of the Electrostatic Society of America, IMAPS, the UK Institute of Physics and is a US Expert to IEC TC101, Electrostatics. 

Efraim Aharoni received the M.Sc. and Ph.D degrees in Physics  in 1989 and 1994 from the Technion, Israel Institute of Technology. His research in the Technion was focused on High Temperature Superconducting devices. In 1993 he joined Tower Semiconductor. Efraim worked in Tower in a variety of fields, in both engineering and management, in development as well as production. Amongst his engineering roles: process, device, yield, director R&D CMOS, and director of reliability. In the past 15 years, he has led the ESD and Latch-Up activities in the company as a senior principal engineer. This involves the development of new ESD devices and protection concepts, creating libraries of ESD devices in PDK, development of a unique concept of ‘empirical ESD modeling (for simulation of circuits containing snap-back based devices), PERC, and customer support. He works closely with the Tower design center, device engineers, PDK group, customers, and production lines, in Tower Semiconductor sites worldwide. Efraim served in the technical committees of IEW and EOS/ESD symposium, is a co-chair of WG22, and a member in the Industry Council of ESD Standards. In addition, he serves as the head of the Electrical Engineering department in the Kinneret College on the sea of Galilee and lectures on a variety of courses.

Kathleen Muhonen is currently an ESD engineer at Qorvo in Greensboro, NC.  She is involved in ESD on-chip protection for RF and Millimeter wave applications.  She is heavily involved in system level testing that helps standardize IED testing of RF components and instrumentation for better ESD characterization of clamps and materials. Previously she was responsible for RF characterization and model support for SOI switches and Gallium Arsenide power amplifiers. She has also done extensive work on developing state of the art harmonic and breakdown characterization system for semiconductors and has improved de-embedding techniques of large-scale modeling structures.  Kathleen's previous experience includes assistant professor at Penn State Erie, linearization design for base stations at Hewlett Packard, and power amplifier design at Lockheed Martin and GE Aerospace. 
Kathleen is a member of the ESD Association and is on all device testing standards committees, including serving as past TLP and HMM workgroup chairs. She has also served on the Board of Directors and is now serving as the education committee chair.  Kathleen received her BSEE degree from Michigan Technological University in 91, a MSEE from Syracuse in 94 and a PH.D.EE from Penn State University in 99. 

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011. Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering and Physics and a master’s in Engineering Mechanics. Outside of work, Andy likes to spend time with his wife and kids.

In 2005, Dr. Mirko Scholz received his Diploma-Engineer (FH) degree in Electrical Engineering from the University of Applied Sciences in Zwickau, Germany. In 2013, Dr. Mirko Scholz received his PhD degree in Electrical Engineering from the Vrije Universiteit in Brussels (VUB), Belgium. From 2005 until 2017, he was working as an ESD researcher in different R&D programs at imec in Leuven, Belgium. From March 2017 until June 2019, he was a program manager in the imec academy and in imec's process technology transfer activities. Since July 2019, he has been with Infineon Technologies in Munich, Germany, where he is a Principal Engineer ESD Development. His daily work focuses on component- and system-level ESD protection design for RF, security, and automotive product lines at Infineon. Since 2007, he has been an active member of different working groups in the ESD Association (ESDA) standards committee, currently co-chairing WG 5.6 (Human Metal Model). He was the management chair of the 2018 International ESD Workshop (IEW) in Belgium. Since 2019, he has been a member of the steering committee of the EOS/ESD Symposium. In this function was the Technical Program Committee (TPC) chair of the 2023 EOS/ESD Symposium. For the 2017-2019 term and again for the 2022-2024 term he has been an elected member of the ESDA Board of Directors. Since 2017, he is leading as a business unit manager the Advanced Topics committee of the ESDA. He has authored/co-authored more than 100 publications, tutorials, and patents in the field of ESD protection design and testing. He is co-author of the 2014 Springer book "System-level ESD protection". He is a regular reviewer for several IEEE journals and a current member of the IRPS sub-committee on ESD and Latchup.

Myung-Hee Na is currently the Vice President and Technology Systems General Manager in Intel, USA. Over 20 years, she has been known as the semiconductor technologist and held various executive positions in global semiconductor companies including US, Belgium and Korea. She has been very diverse and deep semiconductor experiences from device to designs including logic and memory technologies over 20 years.   Prior to joining Intel in April 2024, over the past three years she was Vice President of the Revolutionary Technology Center in SK Hynix, Korea. In this role she was responsible for multi-decade semiconductor research roadmaps and strategies for memory centric and emerging computing domains such as emerging memory, and beyond memory.
From 2019-2023, Myung-Hee also worked at imec in Belgium where she was Vice President, Technology Solutions and Enablement. In this role she was responsible for overall 10-year research strategies for CMOS pathfinding and emerging computing domains such as edge computing. After completing her Ph.D. in Physics, Dr. Na started her career at IBM in 2001, where she held various technical, managerial and executive roles until early 2019. During that time, she was promoted to Distinguished Engineer and Technical Executive. At IBM Research, she successfully led Research and Development for multiple generations of semiconductor technologies, including high-K metal gate, FinFET, and Nanosheet development. Moreover, she has co-authored numerous research papers and U.S. and international patents.

In 2005, Dr. Mirko Scholz received his Diploma-Engineer (FH) degree in Electrical Engineering from the University of Applied Sciences in Zwickau, Germany. In 2013, Dr. Mirko Scholz received his PhD degree in Electrical Engineering from the Vrije Universiteit in Brussels (VUB), Belgium. From 2005 until 2017, he was working as an ESD researcher in different R&D programs at imec in Leuven, Belgium. From March 2017 until June 2019, he was a program manager in the imec academy and in imec's process technology transfer activities. Since July 2019, he has been with Infineon Technologies in Munich, Germany, where he is a Principal Engineer ESD Development. His daily work focuses on component- and system-level ESD protection design for RF, security, and automotive product lines at Infineon. Since 2007, he has been an active member of different working groups in the ESD Association (ESDA) standards committee, currently co-chairing WG 5.6 (Human Metal Model). He was the management chair of the 2018 International ESD Workshop (IEW) in Belgium. Since 2019, he has been a member of the steering committee of the EOS/ESD Symposium. In this function was the Technical Program Committee (TPC) chair of the 2023 EOS/ESD Symposium. For the 2017-2019 term and again for the 2022-2024 term he has been an elected member of the ESDA Board of Directors. Since 2017, he is leading as a business unit manager the Advanced Topics committee of the ESDA. He has authored/co-authored more than 100 publications, tutorials, and patents in the field of ESD protection design and testing. He is co-author of the 2014 Springer book "System-level ESD protection". He is a regular reviewer for several IEEE journals and a current member of the IRPS sub-committee on ESD and Latchup.

Matteo Meneghini received his PhD (University of Padova) working on the optimization of GaN-based LED and laser structures.
He is now a full professor at the Department of Information Engineering at the University of Padova. His main interests are the characterization, reliability, and modeling of compound semiconductor devices (LEDs, laser diodes, HEMTs) and optoelectronic components, including solar cells. He has published more than 400 journal and conference proceedings papers related to these activities.
During his career, he has cooperated and/or co-published with several semiconductor companies and research centers. He has been elected IEEE Fellow (Class of 2025). He and his colleagues have won several best paper awards at international conferences.

In 2005, Dr. Mirko Scholz received his Diploma-Engineer (FH) degree in Electrical Engineering from the University of Applied Sciences in Zwickau, Germany. In 2013, Dr. Mirko Scholz received his PhD degree in Electrical Engineering from the Vrije Universiteit in Brussels (VUB), Belgium. From 2005 until 2017, he was working as an ESD researcher in different R&D programs at imec in Leuven, Belgium. From March 2017 until June 2019, he was a program manager in the imec academy and in imec's process technology transfer activities. Since July 2019, he has been with Infineon Technologies in Munich, Germany, where he is a Principal Engineer ESD Development. His daily work focuses on component- and system-level ESD protection design for RF, security, and automotive product lines at Infineon. Since 2007, he has been an active member of different working groups in the ESD Association (ESDA) standards committee, currently co-chairing WG 5.6 (Human Metal Model). He was the management chair of the 2018 International ESD Workshop (IEW) in Belgium. Since 2019, he has been a member of the steering committee of the EOS/ESD Symposium. In this function was the Technical Program Committee (TPC) chair of the 2023 EOS/ESD Symposium. For the 2017-2019 term and again for the 2022-2024 term he has been an elected member of the ESDA Board of Directors. Since 2017, he is leading as a business unit manager the Advanced Topics committee of the ESDA. He has authored/co-authored more than 100 publications, tutorials, and patents in the field of ESD protection design and testing. He is co-author of the 2014 Springer book "System-level ESD protection". He is a regular reviewer for several IEEE journals and a current member of the IRPS sub-committee on ESD and Latchup.

Ruilong Xie (Senior Member, IEEE) received his Bachelor of Engineering degree in 2006 and Ph.D. degree in 2010 in Electrical and Computer Engineering from the National University of Singapore (NUS). During his Ph.D., he worked in the Silicon Nano Device Laboratory at NUS and was associated with the Institute of Microelectronics, Agency for Science, Technology and Research, Singapore. His doctoral research focused on high-mobility germanium channel MOSFETs with high-k gate dielectrics. In 2009, Ruilong joined Chartered Semiconductor Manufacturing in Singapore, where he contributed to the development of 45nm and 55nm CMOS technologies. He later moved to the GLOBALFOUNDRIES Research division in Albany, NY, working on advanced FinFET technologies (14nm, 10nm, and 7nm FinFET nodes) as part of the IBM Technology Development Alliances. Since 2018, Ruilong has been with IBM Research, focusing on advanced technology nodes, including nanosheet transistors, vertical transistors, and backside interconnect technologies. He holds more than 1,000 U.S. patents and has authored or co-authored over 30 conference and journal papers.