2025 Steering Committee

Strategy Chair - Ann Concannon, Texas Instruments

General Chair - Mirko Scholz, Infineon Technology AG

Vice General Chair - James DiSarro, Texas Instruments

Technical Program Committee - Alain Loiseau, GLOBALFOUNDRIES

Workshop Chair - Slavica Malobabic, Cirrus Logic

Presentation Manager - Marko Simicic, imec

Presentation Co-Manager - Wei Liang, Intel

 

2025 TPC

Advanced CMOS (Analog/Digital) EOS/ESD and Latchup, ESD Protection in Bipolar, RF, High Voltage and BCD Technologies

Prantik Mahajan Renesas
Carol Rouying Zhan ON Semiconductor
Krishna Rajagopal TI
Dolphin Abessolo Bidzo NXP
Shih-Hung Chen imec
Alwyn Rebello GlobalFoundries
Charvaka Duvvury TI Fellow Emeritus

Numerical Modeling and Simulation for On-Chip ESD Protection and Chip/Module/Package EOS/ESD Electronic Design Automation

Kuo-Hsuan Meng Silicon Labs
Eleonora Gevinti STMicroelectronics
Steven Sze Hang Poon TSMC
Paul Zhou Analog
Kateryna  Serbulova imec
Christian Russ Infineon
Nagothu Kranthi Texas Instruments

EOS/ESD Failure Analysis, Troubleshooting and Case Studies

Dimitrios Kontos Analog
Guido Quax NXP
Shudong Huang3 UIUC
Leonardo Di Biccari STMicroelectronics
Mototsugu Okushima Renesas
James Davis Micron
Mujahid Muhammad Intel

Device Testing: Testers, Methods and Correlation Issues

Kathy Muhonen Qorvo
Scott Ward TI
Marko Simicic imec
Brett Carn Intel - retired
Andrea Boroni STMicroelectronics
Tim Maloney Center for Analytic Insights
Robert Ashton  

System Level EOS/ESD/EMC, HMM

Joost Willemen Infineon
Pasi Tamminen Danfoss
Ketan Shringarpure Google
David Pommerenke TU Graz
Martin Pilaski Nexperia
Hans Kunz TI
Harald Gossner Intel

EOS/ESD in Manufacturing

Joshua Yoo Core Insight
Lena Zeitlhöfler Infineon
Toni Viheriäkoski Cascade Metrology
Michelle Lam IBM
Rita Fung Cisco
Gregory Larson Intel
Ellen Merkel Fraunhofer