Committees

2023 Steering Committee

General Chair - Ann Concannon, Texas Instruments

Vice General Chair - Heinrich Wolf, Fraunhofer EMFT

Technical Program Committee Chair - Mirko Scholz, Infineon Technology AG

Workshop Chair - James DiSarro, Texas Instruments

Presentation Manager - Alain Loiseau, GLOBALFOUNDRIES

Presentation Co-Manager - Slavica Malobabic, Cirrus Logic

2023 Technical Program Committee

Chair: Mirko Scholz, Infineon

Advanced CMOS (Analog/Digital) EOS/ESD and Latchup, ESD Protection in Bipolar, RF, High Voltage and BCD Technologies

Sub-Committee Chair: Shih-Hung Chen, imec

Dolphin Abessolo Bidzo, NXP Semiconductors

David Alvarez, Infineon

Chien-Yao Huang, TSMC

Sagar Premnath Karalkar, GlobalFoundries

Benjamin Orr, Intel

Elyse Rosenbaum, University of Illinois - Urbana-Champaign

Teruo Suzuki, SocioNext

Numerical Modeling and Simulation for On-Chip ESD Protection and Chip/Module/Package EOS/ESD Electronic Design Automation

Sub-Committee Chair: Vladislav Vashchenko, Analog Devices, Inc.

Eleonora Gevinti, STMicroelectronics

Steffen Holland, Nexperia

David Marreiro, Alpha & Omega Semiconductor

Kuo-Hsuan Meng, Silicon Laboratories

Kateryna Serbulova, imec

Andrei Shibkov, Angstrom Design Automation

Nitesh Trivedi, Intel

EOS/ESD Failure Analysis, Troubleshooting, and Case Studies

Sub-Committee Chair: Mototsugu Okushima, Renesas

Fabrice Blanc, ARM

Leonardo Di Biccari, STMicroelectronics

Harald Gossner, Intel

Alain Loiseau, GlobalFoundries

Markus Mergens, QPX

Guido Quax, NXP Semiconductors

Yang Xiu, Texas Instruments

Device Testing: Testers, Methods, and Correlation Issues

Sub-Committee Chair: Marcos Hernandez, Thermo Fisher Scientific

Timothy J. Maloney, Center for Analytic Insights

Gregory O'sullivan, Micron

Sheela Verwoerd, NXP Semiconductors

Scott Ward, Texas Instruments

Friedrich zur Nieden, Infineon

System Level EOS, ESD, EMC, HMM

Sub-Committee Chair: Shubhankar Marathe, Amazon

Omid Hosseini, Apple

Kathy Muhonen, Qorvo

Junsik Park, Samsung

David Pommerenke, TU Graz

Theo Smedes, NXP Semiconductors

Joost Willemen, Infineon

EOS/ESD in Manufacturing

Sub-Committee Chair: Andy Nold, Teradyne

Rita Fung, Cisco

Reinhold Gaertner, Infineon

Michelle Lam, IBM

Dale Parkin

Toni Viheriäkoski, Cascade Metrology

Joshua Yoo, Core Insight