Monday, October 2
Hands-on Demonstration: Walking Test
Hands-on Demonstration: Walking Test
M1.1 Die-to-Die ESD Discharge Current Analysis

Pasi Tamminen
Pasi received an M.Sc in Electronics Engineering from Oulu University, Finland, in 1997 and continued to work in NOKIA Networks with automated production technologies, testing, machine vision, process control, and design for manufacturability. From 2001 to 2005, he was at VTT Technical Research Centre of Finland and worked with risk management, EMC/ESD, and cleanroom control methods. Between 2005 and 2012, Pasi worked as the global process owner of ESD and cleanroom control at NOKIA Mobile Phones. Between 2014 and 2015, he worked in Microsoft R&D on product EMC designs. Between 2017 and 2021, Pasi worked in EDR&Medeso with electromagnetics simulations and business development. In parallel, Pasi has worked with IEC and ANSI standardization bodies since 2006, done research on electrostatics, antennas, RF, EMC/ESD failures, component, and system EMC/ESD/RF qualification, and control methods. He joined the Tampere University of Technology in 2012 and received a Doctor of Science and Technology degree in January 2017. Currently, he is working at Danfoss Drives on system-level EMC.
M1.1 Die-to-Die ESD Discharge Current Analysis
M1.2 ESD Mitigation for 3D IC Hybrid Bonding

Shih-Hsiang Lin
Shih-Hsiang Lin received his B.Sc. and M.Sc. in electrical engineering from the National University of Kaohsiung (NUK), Kaohsiung, Taiwan, in 2018, and from National Cheng Kung University (NCKU), Tainan, Taiwan, in 2021, respectively. In addition, he spent one year as an intern at imec in 2021. In 2021 he joined the Department of Electronics and Informatics (ETRO) at the Vrije Universiteit Brussel (VUB) and the ESD team at imec, Belgium, where he is pursuing a Ph.D. His current research topic is ESD risk investigation in three-dimensional (3D) technologies.
M1.2 ESD Mitigation for 3D IC Hybrid Bonding
M1.3 Alternative Measurement Methodology for Fast Switching AC Ionizer Offset Voltage Measurement

Joshua Yoo
Joshua (Yong Hoon) Yoo has been involved in the static control industry since 1994 for ionization and test equipment business operations in semiconductors, flat panel displays, and automotive as a high-tech industry. He has been a member of EOS/ESD Association, Inc. since 2000 and served on the Board of Directors from 2016 to 2018. He is the founder and president of the Korea EOS/ESD Association since 2011. He is an active member of the Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He published a number of technical papers and technical articles for Flat Panel Display ESD Issues, Ionization, and CPM Measurement Technologies. He is an iNARTE-certified ESD Engineer since 2007 and an EOS/ESD Association-certified Professional ESD Program Manager since 2011. He has 12 patents for alternative ionization systems and novel design steady-state DC bar ionization systems.
M1.3 Alternative Measurement Methodology for Fast Switching AC Ionizer Offset Voltage Measurement
M2.2 Electrostatic Discharge Characteristics of Polymer Films

Toni Viheriäkoski
Toni Viheriäkoski established the electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in the healthcare, medical, electronics, automotive, and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received the specialist qualification in business management in 2018 and the 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.
M2.2 Electrostatic Discharge Characteristics of Polymer Films
Authors Corner M1.1, M1.2, M1.3, & M2.2

Toni Viheriäkoski
Toni Viheriäkoski established the electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in the healthcare, medical, electronics, automotive, and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received the specialist qualification in business management in 2018 and the 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.

Joshua Yoo
Joshua (Yong Hoon) Yoo has been involved in the static control industry since 1994 for ionization and test equipment business operations in semiconductors, flat panel displays, and automotive as a high-tech industry. He has been a member of EOS/ESD Association, Inc. since 2000 and served on the Board of Directors from 2016 to 2018. He is the founder and president of the Korea EOS/ESD Association since 2011. He is an active member of the Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He published a number of technical papers and technical articles for Flat Panel Display ESD Issues, Ionization, and CPM Measurement Technologies. He is an iNARTE-certified ESD Engineer since 2007 and an EOS/ESD Association-certified Professional ESD Program Manager since 2011. He has 12 patents for alternative ionization systems and novel design steady-state DC bar ionization systems.

Shih-Hsiang Lin
Shih-Hsiang Lin received his B.Sc. and M.Sc. in electrical engineering from the National University of Kaohsiung (NUK), Kaohsiung, Taiwan, in 2018, and from National Cheng Kung University (NCKU), Tainan, Taiwan, in 2021, respectively. In addition, he spent one year as an intern at imec in 2021. In 2021 he joined the Department of Electronics and Informatics (ETRO) at the Vrije Universiteit Brussel (VUB) and the ESD team at imec, Belgium, where he is pursuing a Ph.D. His current research topic is ESD risk investigation in three-dimensional (3D) technologies.

Pasi Tamminen
Pasi received an M.Sc in Electronics Engineering from Oulu University, Finland, in 1997 and continued to work in NOKIA Networks with automated production technologies, testing, machine vision, process control, and design for manufacturability. From 2001 to 2005, he was at VTT Technical Research Centre of Finland and worked with risk management, EMC/ESD, and cleanroom control methods. Between 2005 and 2012, Pasi worked as the global process owner of ESD and cleanroom control at NOKIA Mobile Phones. Between 2014 and 2015, he worked in Microsoft R&D on product EMC designs. Between 2017 and 2021, Pasi worked in EDR&Medeso with electromagnetics simulations and business development. In parallel, Pasi has worked with IEC and ANSI standardization bodies since 2006, done research on electrostatics, antennas, RF, EMC/ESD failures, component, and system EMC/ESD/RF qualification, and control methods. He joined the Tampere University of Technology in 2012 and received a Doctor of Science and Technology degree in January 2017. Currently, he is working at Danfoss Drives on system-level EMC.
Authors Corner M1.1, M1.2, M1.3, & M2.2
Invited Talk: Surface Resistance vs. Volume Resistance – What are the Differences, and Why Should You Care?

Robert "Hank" Mead
Invited Talk: Surface Resistance vs. Volume Resistance – What are the Differences, and Why Should You Care?
Hands-on Measurement Session: Surface Resistance
Hands-on Measurement Session: Surface Resistance
Hands-on Measurement Session: Volume Resistance
Hands-on Measurement Session: Volume Resistance
Tuesday, October 3
Invited Talk: Introducing ESD TR13.0-02 - A New Technical Report Addressing Unpowered Hand Tools

Christopher Almeras
Christopher Almeras is a Process Engineer and ESD SME for Raytheon Technologies in the Texas Electronics Packaging, Materials, and Processes Department in Dallas, Texas. He is responsible for different Circuit Card Assembly processes, along with capital acquisition as well as the ESD program for Raytheon Intelligence and Space. Christopher is a member of the ESDA Board of Directors, along with several working groups. He earned his ESD Professional Program Manager Certification in 2009. Christopher authored and presented “An ESD Case Study of Defect Analysis in High-Speed Electronics Manufacturing” at the 2018 EOS/ESD Symposium.
Invited Talk: Introducing ESD TR13.0-02 - A New Technical Report Addressing Unpowered Hand Tools
Hands-on Measurement Session: Hand Tools
Hands-on Measurement Session: Hand Tools
Hands-on Demonstration: Walking Test
Hands-on Demonstration: Walking Test
Wednesday, October 4
Hands-on Demonstration: Walking Test
Hands-on Demonstration: Walking Test
M2.1 ESD Risk Assessment for Devices on Printed Circuit Boards

Reinhold Gaertner
Reinhold Gaertner received his diploma in physics from the Technical University of Munich in 1987. Then he joined the Federal Armed Forces University Munich, where he was working on measurement techniques for ESD protective packaging materials. After working as an independent ESD consultant, he joined Siemens Semiconductors in 1996, which is now Infineon Technologies. As Distinguished Engineer for ESD protection, he is responsible for all problems regarding external ESD protection at Infineon worldwide and also for problems in customer production, as well as for ESD device testing for qualification. Since 1989, he has lectured on static control, and since 1991, he has been an active member of the German ESD Association, where he has been acting as vice president for the last couple of years. Since 1995, he has worked in the ESD standardization of IEC TC101 Electrostatics, where he is currently convenor of the working group "Protection of electronic devices against static electricity”. In 2009, he received the outstanding contribution award of the ESDA, and between 2011 and 2019, he was part of the ESDA board of directors.
M2.1 ESD Risk Assessment for Devices on Printed Circuit Boards
M2.3 ESD Process Assessment of 2.5D and 3D Bonding Technologies

Marko Simicic
Marko Simicic received his B.Sc. and M.Sc. in electrical engineering and information technology from the University of Zagreb, Croatia, in 2010 and 2012, respectively. He obtained a Ph.D. from the Department of electrical engineering ESAT, KU Leuven, Belgium, in 2018. In 2017 he joined the ESD team in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 35 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing, and in-depth ESD control process assessment.
M2.3 ESD Process Assessment of 2.5D and 3D Bonding Technologies
Authors Corner M2.1 & M2.3

Reinhold Gaertner
Reinhold Gaertner received his diploma in physics from the Technical University of Munich in 1987. Then he joined the Federal Armed Forces University Munich, where he was working on measurement techniques for ESD protective packaging materials. After working as an independent ESD consultant, he joined Siemens Semiconductors in 1996, which is now Infineon Technologies. As Distinguished Engineer for ESD protection, he is responsible for all problems regarding external ESD protection at Infineon worldwide and also for problems in customer production, as well as for ESD device testing for qualification. Since 1989, he has lectured on static control, and since 1991, he has been an active member of the German ESD Association, where he has been acting as vice president for the last couple of years. Since 1995, he has worked in the ESD standardization of IEC TC101 Electrostatics, where he is currently convenor of the working group "Protection of electronic devices against static electricity”. In 2009, he received the outstanding contribution award of the ESDA, and between 2011 and 2019, he was part of the ESDA board of directors.

Marko Simicic
Marko Simicic received his B.Sc. and M.Sc. in electrical engineering and information technology from the University of Zagreb, Croatia, in 2010 and 2012, respectively. He obtained a Ph.D. from the Department of electrical engineering ESAT, KU Leuven, Belgium, in 2018. In 2017 he joined the ESD team in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 35 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing, and in-depth ESD control process assessment.
Authors Corner M2.1 & M2.3
Invited Talk: Manufacturing Process Assessment

Reinhold Gaertner
Reinhold Gaertner received his diploma in physics from the Technical University of Munich in 1987. Then he joined the Federal Armed Forces University Munich, where he was working on measurement techniques for ESD protective packaging materials. After working as an independent ESD consultant, he joined Siemens Semiconductors in 1996, which is now Infineon Technologies. As Distinguished Engineer for ESD protection, he is responsible for all problems regarding external ESD protection at Infineon worldwide and also for problems in customer production, as well as for ESD device testing for qualification. Since 1989, he has lectured on static control, and since 1991, he has been an active member of the German ESD Association, where he has been acting as vice president for the last couple of years. Since 1995, he has worked in the ESD standardization of IEC TC101 Electrostatics, where he is currently convenor of the working group "Protection of electronic devices against static electricity”. In 2009, he received the outstanding contribution award of the ESDA, and between 2011 and 2019, he was part of the ESDA board of directors.
