Monday, October 2

8:00 AM

Welcome - Track 2

8:10 AM

Impact of Parasitic PCB and EMI Filter Inductances on System-level ESD Protection (German ESD Forum E.V. Best Paper)

8:35 AM

Invited Talk: ESD and EOS Protection in GaN Power ICs

9:55 AM

Invited Talk: GaN MOSHEMT Transistor Technology and Integrated ESD Device Solutions on 300mm GaN-on-Si(111) Wafers

11:15 AM

2A.1 Understanding Temperature Dependence of ESD Reliability in AlGaN/GaN HEMTs

11:40 AM

2A.2 Interplay of Surface Passivation and Electric Field in Determining ESD Behavior of p-GaN Gated AlGaN/GaN HEMTs

12:05 PM

2A.3 Solutions To Improve HBM ESD Robustness of GaN RF HEMTs

12:30 PM

Authors Corner 2A.1, 2A.2, & 2A.3

1:30 PM

M1.1 Die-to-Die ESD Discharge Current Analysis

1:55 PM

M1.2 ESD Mitigation for 3D IC Hybrid Bonding

2:20 PM

M1.3 Alternative Measurement Methodology for Fast Switching AC Ionizer Offset Voltage Measurement

2:45 PM

M2.2 Electrostatic Discharge Characteristics of Polymer Films

3:10 PM

Authors Corner M1.1, M1.2, M1.3, & M2.2

3:40 PM

Invited Talk: Surface Resistance vs. Volume Resistance – What are the Differences, and Why Should You Care?

4:00 PM

Hands-on Measurement Session: Surface Resistance

5:05 PM

Hands-on Measurement Session: Volume Resistance

Tuesday, October 3

10:35 AM

Invited Talk: Introducing ESD TR13.0-02 - A New Technical Report Addressing Unpowered Hand Tools

Wednesday, October 4

9:55 AM

Invited Talk: Automotive Semiconductor Testing - Challenges and Solutions Towards Zero Defect Quality

10:45 AM

2B.1 Complementary HV Dual Direction SCR Design Strategy

11:10 AM

2B.2 Electro-Thermal Mixed-Mode Analysis of HV Complementary DD-SCR's

11:35 AM

Authors Corner 2B.1 & 2B.2

12:05 PM

M2.1 ESD Risk Assessment for Devices on Printed Circuit Boards

12:30 PM

M2.3 ESD Process Assessment of 2.5D and 3D Bonding Technologies

12:55 PM

Authors Corner M2.1 & M2.3

3:35 PM

Invited Talk: Manufacturing Process Assessment

4:05 PM

Hands-on Measurement Session: Process Assessment